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MSP430FR5736IPW

Texas Instruments

MSP430FR5736IPW by Texas Instruments

MSP430FR5736IPW by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 16384 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption. Featuring peripherals like comparators, CRC, DMA, RTC, and timers, it offers connectivity options such as I2C, IRDA, SCI, SPI, and UART for versatile usage.

Median Price

$2.381

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,650 parts In-Stock

1+ parts

$2.672

100+ parts

$2.178

1k+ parts

$1.452

10k+ parts

-

12,650

$2.672

$2.178

$1.452

-

Rochester

USA . 69 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.870

10k+ parts

$1.760

69

-

$2.090

$1.870

$1.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,349 parts In-Stock

1+ parts

$1.919

100+ parts

-

1k+ parts

-

10k+ parts

-

3,349

$1.919

-

-

-

Vyrian

USA . 3,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,349

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,973 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

5,973

$1.720

-

-

-

Corphita

USA . 4,932 parts In-Stock

1+ parts

$1.818

100+ parts

-

1k+ parts

-

10k+ parts

-

4,932

$1.818

-

-

-

AZTECH Wire

Italy . 983 parts In-Stock

1+ parts

$9.990

100+ parts

-

1k+ parts

-

10k+ parts

-

983

$9.990

-

-

-

Microchip USA

USA . 1,076 parts In-Stock

1+ parts

$18.590

100+ parts

$18.470

1k+ parts

$18.420

10k+ parts

$18.360

1,076

$18.590

$18.470

$18.420

$18.360

Parana Technologies

USA . 584 parts In-Stock

1+ parts

$47.979

100+ parts

-

1k+ parts

-

10k+ parts

-

584

$47.979

-

-

-

ChromeModa Solutions

Germany . 1,535 parts In-Stock

1+ parts

$53.909

100+ parts

$44.205

1k+ parts

-

10k+ parts

-

1,535

$53.909

$44.205

-

-

IDEA Electronic Components Group

UK . 1,159 parts In-Stock

1+ parts

$53.909

100+ parts

$51.214

1k+ parts

$48.518

10k+ parts

-

1,159

$53.909

$51.214

$48.518

-

DigiPath Technology Company

USA . 364 parts In-Stock

1+ parts

-

100+ parts

$48.604

1k+ parts

-

10k+ parts

-

364

-

$48.604

-

-

Perfect Parts

USA . 245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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245

-

-

-

-

Overview

Discover the innovative MSP430FR5736IPW microcontroller by Texas Instruments, a leading manufacturer known for quality and reliability. This versatile device offers a wide range of applications in various industries, providing customers with unmatched value and benefits. With advanced features like low power mode, connectivity options, and FRAM programmability, this product delivers superior performance and efficiency. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and drive success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications without adding unnecessary weight.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows the microcontroller to handle more power-intensive tasks and components, expanding its functionality.

Bit Size: 16

A 16-bit microcontroller provides better performance and precision compared to lower bit sizes, making it suitable for complex applications that require high computational power.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and signals, making it versatile for applications that require analog-to-digital conversion.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller, it offers high performance and efficient instruction execution, making it a good choice for applications that require fast processing and low power consumption.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

Multiple connectivity options allow the microcontroller to communicate with various devices and peripherals, making it suitable for diverse networking and communication applications.

Technical Specifications

Microcontrollers MSP430FR5736IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

21

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Trade Compliance

MSP430FR5736IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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