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MSP430FR5735IDAR

Texas Instruments

MSP430FR5735IDAR by Texas Instruments

MSP430FR5735IDAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 14-Ch ADC, PWM channels, and various connectivity options (I2C, IRDA, SCI, SPI, UART), it offers versatile solutions in compact form factor.

Median Price

$1.602

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,430 parts In-Stock

1+ parts

$1.350

100+ parts

$1.320

1k+ parts

$1.300

10k+ parts

-

3,430

$1.350

$1.320

$1.300

-

Texas Instruments

USA . 13,148 parts In-Stock

1+ parts

$1.855

100+ parts

$1.512

1k+ parts

$1.008

10k+ parts

-

13,148

$1.855

$1.512

$1.008

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,241 parts In-Stock

1+ parts

$1.762

100+ parts

-

1k+ parts

-

10k+ parts

-

2,241

$1.762

-

-

-

Vyrian

USA . 8,818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,818

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,377 parts In-Stock

1+ parts

$1.670

100+ parts

-

1k+ parts

-

10k+ parts

-

3,377

$1.670

-

-

-

Microchip USA

USA . 1,609 parts In-Stock

1+ parts

$8.801

100+ parts

-

1k+ parts

-

10k+ parts

-

1,609

$8.801

-

-

-

AZTECH Wire

Italy . 1,199 parts In-Stock

1+ parts

$17.160

100+ parts

-

1k+ parts

-

10k+ parts

-

1,199

$17.160

-

-

-

Parana Technologies

USA . 28 parts In-Stock

1+ parts

$57.122

100+ parts

-

1k+ parts

-

10k+ parts

-

28

$57.122

-

-

-

ChromeModa Solutions

Germany . 6,264 parts In-Stock

1+ parts

$64.182

100+ parts

$52.629

1k+ parts

-

10k+ parts

-

6,264

$64.182

$52.629

-

-

IDEA Electronic Components Group

UK . 908 parts In-Stock

1+ parts

$64.182

100+ parts

$60.973

1k+ parts

$57.764

10k+ parts

-

908

$64.182

$60.973

$57.764

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Perfect Parts

USA . 11,155 parts In-Stock

1+ parts

-

100+ parts

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11,155

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QUARKTWIN TECHNOLOGY LTD

USA . 5,670 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,670

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DigiPath Technology Company

USA . 484 parts In-Stock

1+ parts

-

100+ parts

$57.866

1k+ parts

-

10k+ parts

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484

-

$57.866

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-

Overview

Discover the cutting-edge MSP430FR5735IDAR microcontroller from Texas Instruments, setting new standards in quality and performance. Ideal for a wide range of applications, this innovative device offers unparalleled value with its advanced features and benefits. With a focus on low power consumption and high efficiency, the MSP430FR5735IDAR delivers reliable results while maximizing functionality. Trust in Texas Instruments to deliver top-notch technology that exceeds expectations, making your projects more efficient and effective than ever before. Join the revolution and experience the difference with the MSP430FR5735IDAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the microcontroller within a safe operating range.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with existing systems and resources, making it easier for integration.

ADC Channels: YES

Supports analog to digital conversion, enabling the microcontroller to interface with sensors and other analog devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture provides efficient processing capabilities, making the microcontroller suitable for a wide range of applications.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

Offers versatile communication options, allowing the microcontroller to easily interface with different devices and peripherals.

Low Power Mode: YES

Enables power-efficient operation, making the microcontroller ideal for battery-powered or energy-conscious applications.

Technical Specifications

Microcontrollers MSP430FR5735IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

30

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

MSP430FR5735IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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