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MSP430FR5733IRHAT

Texas Instruments

MSP430FR5733IRHAT by Texas Instruments

MSP430FR5733IRHAT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption. With connectivity options like I2C, SCI, and UART, it offers versatile peripheral support for various embedded systems.

Median Price

$2.878

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,618 parts In-Stock

1+ parts

$2.226

100+ parts

$1.815

1k+ parts

$1.210

10k+ parts

-

22,618

$2.226

$1.815

$1.210

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DigiKey

USA . 498 parts In-Stock

1+ parts

$3.530

100+ parts

$2.202

1k+ parts

$2.087

10k+ parts

-

498

$3.530

$2.202

$2.087

-

Distributors (In-Stock)

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Digiode

USA . 1,507 parts In-Stock

1+ parts

$2.115

100+ parts

-

1k+ parts

-

10k+ parts

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1,507

$2.115

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-

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Vyrian

USA . 2,397 parts In-Stock

1+ parts

-

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2,397

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Distributors (Availability)

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Corphita

USA . 1,023 parts In-Stock

1+ parts

$2.003

100+ parts

-

1k+ parts

-

10k+ parts

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1,023

$2.003

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-

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Microchip USA

USA . 1,228 parts In-Stock

1+ parts

$14.700

100+ parts

$14.610

1k+ parts

$14.560

10k+ parts

$14.510

1,228

$14.700

$14.610

$14.560

$14.510

Parana Technologies

USA . 1,239 parts In-Stock

1+ parts

$56.638

100+ parts

-

1k+ parts

-

10k+ parts

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1,239

$56.638

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-

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DigiPath Technology Company

USA . 1,496 parts In-Stock

1+ parts

$62.365

100+ parts

-

1k+ parts

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10k+ parts

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1,496

$62.365

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ChromeModa Solutions

Germany . 5,014 parts In-Stock

1+ parts

$63.638

100+ parts

$52.183

1k+ parts

-

10k+ parts

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5,014

$63.638

$52.183

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IDEA Electronic Components Group

UK . 2,081 parts In-Stock

1+ parts

$63.638

100+ parts

$60.456

1k+ parts

$57.274

10k+ parts

-

2,081

$63.638

$60.456

$57.274

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QUARKTWIN TECHNOLOGY LTD

USA . 6,129 parts In-Stock

1+ parts

-

100+ parts

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6,129

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Metaverse IC Inc.

Canada . 311 parts In-Stock

1+ parts

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311

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430FR5733IRHAT microcontroller. Designed for efficiency and reliability, this powerful device offers a wide range of applications in various industries. With advanced features such as low power mode, connectivity options, and on-chip program ROM, this microcontroller provides exceptional value and performance to customers looking to streamline their designs and enhance productivity. Trust in Texas Instruments' reputation for quality and innovation, and take your projects to the next level with the MSP430FR5733IRHAT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for efficient assembly and compact design, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power input, providing flexibility in design.

On Chip Data RAM Width: 8

Having a data RAM width of 8 enhances data processing capabilities and allows for efficient handling of data within the microcontroller.

Package Shape: SQUARE

The square package shape offers a compact form factor, making it easier to integrate the microcontroller into various electronic devices.

Bit Size: 16

A 16-bit size allows for increased computational power and precision, making the microcontroller suitable for handling complex algorithms and tasks.

No. of Terminals: 40

Having 40 terminals enables versatile connectivity options and interfaces, enhancing the overall functionality of the microcontroller.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers efficient heat dissipation and space-saving features, making the product ideal for compact designs.

Minimum Supply Voltage: 2 V

The low minimum supply voltage allows for power-efficient operation and extends the battery life of devices using this microcontroller.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand elevated temperature conditions, ensuring reliable performance in challenging environments.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it an excellent choice for battery-powered or energy-efficient applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the microcontroller to function reliably in harsh cold environments, expanding its usability in various applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable electrical connections for the microcontroller.

ADC Channels: YES

The availability of ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its capability to handle a wide range of inputs.

DMA Channels: YES

DMA channels enable efficient data transfer without CPU intervention, improving overall system performance and efficiency.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and routing, making it easier to design and assemble circuits with this microcontroller.

ROM Words: 8192

With a ROM size of 8192 words, the microcontroller can store a significant amount of program code, allowing for complex algorithm implementation and functionality.

Maximum Seated Height: 1 mm

A low maximum seated height enables the microcontroller to be used in slim and compact designs, saving space in electronic devices.

Width: 6 mm

The 6mm width provides a balance between compactness and ease of integration, making this microcontroller versatile for a range of applications.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging PCBs, ensuring high reliability and quality during the manufacturing process.

Peripherals: COMPATATOR(16), CRC, DMA(3), RTC, TIMER(5)

The various peripherals, such as comparators, CRC, DMA, RTC, and timers, offer additional features and functionality to the microcontroller, enhancing its versatility.

Maximum Clock Frequency: 24 MHz

A high clock frequency of 24 MHz allows for fast and responsive performance, making this microcontroller suitable for applications requiring real-time processing.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the microcontroller can withstand the high-temperature soldering process during assembly, ensuring robust manufacturing.

Length: 6 mm

The 6mm length contributes to the overall compactness of the microcontroller, making it suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments, making this microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, this product offers efficient data processing, reduced power consumption, and high performance for embedded applications.

No. of Timers: 5

Having 5 timers allows for precise timing and synchronization of tasks, enhancing the functionality and performance of devices using this microcontroller.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller can store and manipulate data efficiently, enabling faster processing and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making this microcontroller energy-efficient and suitable for portable or battery-operated devices.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering and assembly processes, ensuring reliable electrical connections and improving overall manufacturability.

Maximum Supply Current: 4.3 mA

With a low maximum supply current, the microcontroller consumes minimal power during operation, contributing to energy efficiency and longer battery life.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V provides compatibility with standard power sources, making it easy to integrate this microcontroller into existing electronic systems.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals and motor speed, making this microcontroller suitable for applications requiring accurate modulation.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

The various connectivity options, including I2C, IRDA, SCI, SPI, and UART, enable seamless communication with external devices, expanding the versatility and compatibility of the microcontroller.

ROM Programmability: FRAM

ROM programmability using FRAM technology provides fast and reliable non-volatile memory, allowing for easy and secure storage of program code and data.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm offers high-density packaging and simplifies PCB layout, making it easier to design compact circuits with this microcontroller.

Format: FIXED POINT

The fixed-point format allows for efficient integer arithmetic and precise numerical calculations, making this microcontroller suitable for applications requiring accurate computation.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, making proper handling and storage important for maintaining the reliability and performance of the microcontroller.

Speed: 24 rpm

With a speed of 24 rpm, this microcontroller can process instructions and data quickly, ensuring responsive performance in time-sensitive applications.

Low Power Mode: YES

The low power mode functionality allows the microcontroller to conserve energy and extend battery life, making it suitable for power-sensitive applications.

On Chip Program ROM Width: 8

Having an on-chip program ROM width of 8 facilitates efficient storage and access to program code, enhancing the overall performance and functionality of the microcontroller.

No. of I/O Lines: 32

With 32 I/O lines, the microcontroller offers versatile input/output capabilities, enabling robust interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430FR5733IRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Trade Compliance

MSP430FR5733IRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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