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MSP430FR5733IDAR

Texas Instruments

MSP430FR5733IDAR by Texas Instruments

MSP430FR5733IDAR by Texas Instruments is a 16-bit microcontroller with 2.5/3.3V power supplies, 1024 bytes of RAM, and 30 I/O lines. It is ideal for industrial applications requiring a max clock frequency of 24MHz, ADC and DMA channels, and FRAM ROM programmability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,041 parts In-Stock

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Digiode

USA . 461 parts In-Stock

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461

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AZTECH Wire

Italy . 785 parts In-Stock

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$16.357

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$16.357

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One Stop Electronics

USA . 874 parts In-Stock

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$25.000

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Parana Technologies

USA . 538 parts In-Stock

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$37.149

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DigiPath Technology Company

USA . 1,395 parts In-Stock

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$40.905

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$37.633

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$40.905

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ChromeModa Solutions

Germany . 6,976 parts In-Stock

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$41.740

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$34.227

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IDEA Electronic Components Group

UK . 711 parts In-Stock

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$41.740

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$39.653

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$37.566

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711

$41.740

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$37.566

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Corphita

USA . 806 parts In-Stock

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Microchip USA

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5733IDAR microcontroller. Designed with cutting-edge technology and expertise, this versatile device offers customers unparalleled value and benefits for a wide range of applications. From smart home devices to industrial automation, the MSP430FR5733IDAR delivers reliable performance, efficiency, and flexibility to meet your unique needs. Trust in Texas Instruments for quality, reliability, and innovation that propels your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and a lightweight design for easy handling and mounting.

Surface Mount: YES

Surface mount capability allows for compact and efficient PCB design, saving space and reducing overall production costs.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V provides flexibility in power input options, making it suitable for a variety of applications.

Bit Size: 16

The 16-bit architecture offers enhanced processing capabilities, allowing for more complex tasks to be executed efficiently.

No. of Terminals: 38

Having 38 terminals allows for versatile connectivity options and the potential to interface with a wide range of peripherals and devices.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C ensures reliable performance in extreme environments, making it suitable for industrial applications.

ADC Channels: YES

Analog-to-Digital Converter (ADC) channels enable the microcontroller to convert analog signals into digital data, enhancing its versatility for sensor interfacing and data acquisition.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller can efficiently store and access data, facilitating smooth operation and multitasking capabilities.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control over the output signals, making the microcontroller suitable for applications such as motor control and power management.

Technical Specifications

Microcontrollers MSP430FR5733IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

30

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5733IDAR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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