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MSP430FR5732IPWR

Texas Instruments

MSP430FR5732IPWR by Texas Instruments

MSP430FR5732IPWR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 24 MHz, making it suitable for industrial applications requiring low power consumption and high-speed processing. With PWM channels, ADC, and DMA support, this MCU offers versatile functionality in a compact package ideal for IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,864 parts In-Stock

1+ parts

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8,864

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Digiode

USA . 2,727 parts In-Stock

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2,727

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 569 parts In-Stock

1+ parts

$11.203

100+ parts

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569

$11.203

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One Stop Electronics

USA . 932 parts In-Stock

1+ parts

$32.000

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932

$32.000

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Parana Technologies

USA . 2,067 parts In-Stock

1+ parts

$56.168

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2,067

$56.168

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ChromeModa Solutions

Germany . 3,295 parts In-Stock

1+ parts

$63.110

100+ parts

$51.750

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3,295

$63.110

$51.750

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IDEA Electronic Components Group

UK . 1,412 parts In-Stock

1+ parts

$63.110

100+ parts

$59.954

1k+ parts

$56.799

10k+ parts

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1,412

$63.110

$59.954

$56.799

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Corphita

USA . 4,738 parts In-Stock

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4,738

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DigiPath Technology Company

USA . 2,280 parts In-Stock

1+ parts

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$56.900

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2,280

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$56.900

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Microchip USA

USA . 204 parts In-Stock

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204

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR5732IPWR microcontroller. Crafted with precision and expertise, this versatile device offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation, the MSP430FR5732IPWR delivers cutting-edge technology in a compact and efficient package. Experience seamless integration, enhanced functionality, and optimized power consumption with this exceptional microcontroller. Elevate your projects to new heights with the Texas Instruments MSP430FR5732IPWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the microcontroller easy to handle and suitable for various applications.

Surface Mount: YES

Surface-mount technology enables easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

With a high supply voltage tolerance, this microcontroller can handle a wide range of power sources, increasing flexibility in design.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into circuit designs and PCB layouts, optimizing space usage.

Bit Size: 16

A 16-bit architecture provides increased processing power and precision, making the microcontroller suitable for complex tasks and calculations.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows compatibility with different systems, enhancing the microcontroller's versatility.

No. of Terminals: 28

A higher number of terminals provide more connectivity options for peripherals and external devices, expanding the microcontroller's capabilities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design save space on the PCB, allowing for compact and efficient product designs.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement ensures operation in a wide range of power conditions, increasing the microcontroller's reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial applications where heat resistance is crucial.

CPU Family: MSP430

Part of the MSP430 family, this microcontroller benefits from a long heritage of proven performance, reliability, and compatibility with various development tools.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function in harsh environments or cold conditions, enhancing its durability.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections for the microcontroller.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and devices, expanding its input capabilities.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and reduce CPU load, enhancing the overall performance of the microcontroller.

Terminal Position: DUAL

Dual terminal positioning allows for better PCB layout options and signal routing, optimizing the overall design and performance of the microcontroller.

ROM Words: 8192

The large ROM capacity provides ample storage for firmware, programs, and data, accommodating complex applications and algorithms.

Maximum Seated Height: 1.2 mm

A low seated height profile saves space in the overall product design, especially important for compact electronic devices.

Width: 4.4 mm

A narrow width dimension allows for compact PCB layouts and space-efficient designs, ideal for miniaturized electronic products.

Maximum Clock Frequency: 24 MHz

High clock frequency capability enables fast processing speeds and real-time responsiveness, making the microcontroller suitable for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for 30 seconds ensures reliable soldering during manufacturing processes, improving product quality.

Peak Reflow Temperature °C: 260

A high peak reflow temperature tolerance allows for lead-free soldering processes, complying with RoHS standards and environmental regulations.

Length: 9.7 mm

An optimal length dimension for easy integration in various electronic designs, providing flexibility in product layouts and configurations.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making the microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller uses a RISC architecture, known for its efficiency, simplicity, and high performance, ensuring optimal processing capabilities.

RAM Bytes: 1024

A generous amount of RAM allows for efficient data storage, processing, and multitasking capabilities, essential for demanding applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and reliable operation, enhancing the overall efficiency and performance of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and assembly processes, ensuring stable connections and consistent performance of the microcontroller.

Maximum Supply Current: 4.3 mA

Low maximum supply current consumption helps minimize power usage and heat dissipation, ideal for battery-powered devices or energy-efficient applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage provides stable and reliable power to the microcontroller, ensuring consistent performance and operation in various scenarios.

PWM Channels: YES

Pulse-width modulation channels enable precise control of digital signals, making the microcontroller suitable for applications requiring modulation or control of power or speed.

ROM Programmability: MROM

Mask ROM programmability ensures data integrity and security, making it suitable for applications where firmware or data needs to be permanently stored and protected.

Terminal Pitch: 0.65 mm

A tight terminal pitch allows for high-density packaging and efficient use of PCB real estate, ideal for compact designs or space-constrained applications.

Speed: 24 rpm

With a speed of 24 revolutions per minute, this microcontroller can efficiently process data and execute commands, suitable for real-time or time-sensitive applications.

No. of I/O Lines: 21

A sufficient number of input/output lines provide versatile connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers MSP430FR5732IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

21

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5732IPWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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