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MSP430FR5729IRHAT

Texas Instruments

MSP430FR5729IRHAT by Texas Instruments

MSP430FR5729IRHAT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 16384 ROM words. It features 14-Ch 10-Bit ADC channels, 3 DMA channels, and operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$3.097

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,250 parts In-Stock

1+ parts

$3.097

100+ parts

$2.525

1k+ parts

$1.683

10k+ parts

-

1,250

$3.097

$2.525

$1.683

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DigiKey

USA . 229 parts In-Stock

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-

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229

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Distributors (In-Stock)

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Digiode

USA . 1,581 parts In-Stock

1+ parts

$2.942

100+ parts

-

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1,581

$2.942

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Vyrian

USA . 7,112 parts In-Stock

1+ parts

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7,112

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VRG Components

USA . 1,950 parts In-Stock

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1,950

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Distributors (Availability)

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Ampacity Inc.

Singapore . 254 parts In-Stock

1+ parts

$2.630

100+ parts

-

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254

$2.630

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Corphita

USA . 1,142 parts In-Stock

1+ parts

$2.787

100+ parts

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1,142

$2.787

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$27.632

100+ parts

$27.355

1k+ parts

$26.250

10k+ parts

-

300

$27.632

$27.355

$26.250

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Parana Technologies

USA . 508 parts In-Stock

1+ parts

$56.000

100+ parts

$5,200.421

1k+ parts

$50.400

10k+ parts

-

508

$56.000

$5,200.421

$50.400

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DigiPath Technology Company

USA . 1,559 parts In-Stock

1+ parts

$61.663

100+ parts

$56.730

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1,559

$61.663

$56.730

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ChromeModa Solutions

Germany . 6,352 parts In-Stock

1+ parts

$62.921

100+ parts

$51.595

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6,352

$62.921

$51.595

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IDEA Electronic Components Group

UK . 917 parts In-Stock

1+ parts

$62.921

100+ parts

$59.775

1k+ parts

$56.629

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917

$62.921

$59.775

$56.629

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Perfect Parts

USA . 15,120 parts In-Stock

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Lixinc

USA . 7,995 parts In-Stock

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7,995

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Authorized Procurement Solutions

USA . 248 parts In-Stock

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248

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Overview

Unlock a world of possibilities with the MSP430FR5729IRHAT by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled quality and reliability. From industrial applications to IoT devices, this powerful chip caters to a wide range of needs. With low power consumption and high performance, customers can trust in its value and benefits. Experience seamless connectivity, efficient operation, and innovative features that make the MSP430FR5729IRHAT a standout choice for all your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The high supply voltage allows for flexibility in power requirements and compatibility with various systems.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with existing designs and support resources.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the product suitable for both indoor and outdoor applications.

Analog To Digital Convertors: 14-Ch 10-Bit

With multiple ADC channels and high resolution, the product can accurately convert analog signals to digital data.

No. of Timers: 5

Having multiple timers allows for precise timing control and synchronization of tasks in the system.

Peripherals: COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)

The variety of peripherals available enhances the product's functionality and performance in different applications.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

The multiple connectivity options enable easy communication and integration with other devices in a system.

Technical Specifications

Microcontrollers MSP430FR5729IRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

MSP430FR5729IRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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