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MSP430FR5724IRGER

Texas Instruments

MSP430FR5724IRGER by Texas Instruments

MSP430FR5724IRGER by Texas Instruments is a 16-bit microcontroller with 24 MHz clock frequency, 1024 bytes RAM, and 14-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features FRAM ROM programmability and connectivity options like I2C, SCI, SPI.

Median Price

$2.133

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33,000 parts In-Stock

1+ parts

$2.133

100+ parts

$1.869

1k+ parts

$1.056

10k+ parts

-

33,000

$2.133

$1.869

$1.056

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 55 parts In-Stock

1+ parts

$2.026

100+ parts

-

1k+ parts

-

10k+ parts

-

55

$2.026

-

-

-

Vyrian

USA . 2,345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,345

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,347 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

-

10k+ parts

-

4,347

$1.920

-

-

-

AZTECH Wire

Italy . 869 parts In-Stock

1+ parts

$20.320

100+ parts

-

1k+ parts

-

10k+ parts

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869

$20.320

-

-

-

Parana Technologies

USA . 1,586 parts In-Stock

1+ parts

$42.533

100+ parts

-

1k+ parts

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10k+ parts

-

1,586

$42.533

-

-

-

DigiPath Technology Company

USA . 91 parts In-Stock

1+ parts

$46.834

100+ parts

-

1k+ parts

-

10k+ parts

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91

$46.834

-

-

-

ChromeModa Solutions

Germany . 492 parts In-Stock

1+ parts

$47.790

100+ parts

$39.188

1k+ parts

-

10k+ parts

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492

$47.790

$39.188

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-

IDEA Electronic Components Group

UK . 88 parts In-Stock

1+ parts

$47.790

100+ parts

$45.400

1k+ parts

$43.011

10k+ parts

-

88

$47.790

$45.400

$43.011

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A-Z Elektronik GmbH

Germany . 6,483 parts In-Stock

1+ parts

-

100+ parts

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6,483

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Microchip USA

USA . 3,267 parts In-Stock

1+ parts

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3,267

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430FR5724IRGER microcontroller. Designed for maximum efficiency and performance, this chip is perfect for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. With a focus on quality and reliability, Texas Instruments ensures that every product meets the highest standards, providing customers with unparalleled value and benefits. Experience seamless connectivity, low power consumption, and advanced features with this innovative microcontroller, setting new standards for the industry. Elevate your projects with the MSP430FR5724IRGER and revolutionize the way you work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount packaging makes the microcontroller easy to integrate into a variety of electronic devices.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for greater flexibility in voltage requirements for the device.

No. of Terminals: 24

With a higher number of terminals, this microcontroller offers more connectivity options and functionality.

Bit Size: 16

A 16-bit architecture allows for more complex operations and calculations, making the microcontroller suitable for a wide range of applications.

CPU Family: MSP430

Belonging to the MSP430 family indicates high efficiency and low power consumption, making it ideal for battery-powered devices.

ADC Channels: YES

The presence of Analog-to-Digital Converters allows the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer without CPU intervention, improving overall system performance.

Maximum Clock Frequency: 24 MHz

A high clock frequency enables fast processing speed, making the microcontroller suitable for real-time applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing reduced instruction set computing (RISC) architecture provides high performance and efficiency in executing instructions.

Technical Specifications

Microcontrollers MSP430FR5724IRGER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

21

No. of Serial I/Os:

2

No. of Terminals:

24

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

MSP430FR5724IRGER Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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