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MSP430FR5723IDAR

Texas Instruments

MSP430FR5723IDAR by Texas Instruments

MSP430FR5723IDAR by Texas Instruments is a 16-bit microcontroller with 2.5/3.3V supplies, 24MHz clock frequency, and FRAM ROM programmability. Ideal for industrial applications, it features 1024 bytes of RAM, ADC and DMA channels, and 30 I/O lines for efficient data processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,904 parts In-Stock

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6,904

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Digiode

USA . 4,470 parts In-Stock

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4,470

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Distributors (Availability)

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One Stop Electronics

USA . 811 parts In-Stock

1+ parts

$5.000

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811

$5.000

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AZTECH Wire

Italy . 511 parts In-Stock

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$9.932

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511

$9.932

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Parana Technologies

USA . 1,816 parts In-Stock

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$42.730

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1,816

$42.730

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DigiPath Technology Company

USA . 1,271 parts In-Stock

1+ parts

$47.051

100+ parts

$43.287

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1,271

$47.051

$43.287

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ChromeModa Solutions

Germany . 3,251 parts In-Stock

1+ parts

$48.011

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$39.369

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3,251

$48.011

$39.369

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IDEA Electronic Components Group

UK . 95 parts In-Stock

1+ parts

$48.011

100+ parts

$45.610

1k+ parts

$43.210

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95

$48.011

$45.610

$43.210

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Corphita

USA . 530 parts In-Stock

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530

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Microchip USA

USA . 452 parts In-Stock

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452

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Overview

Unlock a world of possibilities with the Texas Instruments MSP430FR5723IDAR microcontroller. Designed with cutting-edge technology by a trusted manufacturer, this versatile device offers unmatched performance for a wide range of applications. From IoT devices to industrial automation, this compact and powerful microcontroller ensures seamless operation and efficient power management. Experience superior quality, reliability, and innovation with the MSP430FR5723IDAR, providing you with the value and benefits you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage range for versatile applications.

Bit Size: 16

16-bit architecture enables higher processing power and data handling capabilities.

CPU Family: MSP430

MSP430 family is known for low power consumption and high performance, making it ideal for energy-efficient designs.

RAM Bytes: 1024

Ample RAM capacity for storing and processing data efficiently.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing speed and performance for efficient operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

PWM Channels: YES

PWM channels enable precise control of analog signals for various applications.

Technical Specifications

Microcontrollers MSP430FR5723IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

30

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5723IDAR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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