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MSP430FR5721IDAR

Texas Instruments

MSP430FR5721IDAR by Texas Instruments

MSP430FR5721IDAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 4096 ROM words. It features 14-Ch 10-Bit ADC channels, 3 DMA channels, and operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$2.133

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,405 parts In-Stock

1+ parts

$2.133

100+ parts

$1.869

1k+ parts

$1.056

10k+ parts

-

19,405

$2.133

$1.869

$1.056

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,899 parts In-Stock

1+ parts

$2.026

100+ parts

-

1k+ parts

-

10k+ parts

-

2,899

$2.026

-

-

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Vyrian

USA . 6,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,397

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,023 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2,023

$1.920

-

-

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AZTECH Wire

Italy . 339 parts In-Stock

1+ parts

$14.970

100+ parts

-

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339

$14.970

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-

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Parana Technologies

USA . 63 parts In-Stock

1+ parts

$15.206

100+ parts

-

1k+ parts

$15.605

10k+ parts

-

63

$15.206

-

$15.605

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ChromeModa Solutions

Germany . 6,359 parts In-Stock

1+ parts

$17.085

100+ parts

$14.010

1k+ parts

-

10k+ parts

-

6,359

$17.085

$14.010

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IDEA Electronic Components Group

UK . 1,499 parts In-Stock

1+ parts

$17.085

100+ parts

$16.231

1k+ parts

$15.376

10k+ parts

-

1,499

$17.085

$16.231

$15.376

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Perfect Parts

USA . 26,880 parts In-Stock

1+ parts

-

100+ parts

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26,880

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DigiPath Technology Company

USA . 342 parts In-Stock

1+ parts

-

100+ parts

$15.404

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342

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$15.404

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Component Stockers USA

USA . 180 parts In-Stock

1+ parts

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100+ parts

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180

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5721IDAR microcontroller. Designed with precision and quality in mind, this versatile device offers a wide range of applications in various industries. From energy-efficient IoT devices to advanced automation systems, the MSP430FR5721IDAR delivers unmatched performance and reliability. Experience the benefits of low power consumption, high-speed processing, and seamless connectivity for your next project. Elevate your designs with Texas Instruments' cutting-edge technology and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, providing flexibility in power sources for the device.

On Chip Data RAM Width: 8

Having a wide data RAM width enables efficient data processing and storage capabilities.

Bit Size: 16

With a 16-bit architecture, this microcontroller can handle more complex operations and calculations.

Power Supplies (V): 2.5/3.3

Compatible with common power supply voltages, ensuring easy integration into various systems.

No. of Terminals: 38

Sufficient number of terminals for connecting peripherals and external components, enhancing the microcontroller's functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and allows for denser designs in electronic applications.

Minimum Supply Voltage: 2 V

Can operate at low supply voltages, enabling energy-efficient performance in battery-powered devices.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications and harsh environments.

CPU Family: MSP430

Part of a well-established and reliable CPU family known for low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for reliable terminal connections.

ADC Channels: YES

Built-in Analog to Digital Converters offer the ability to interface with and process analog signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and offload the CPU for better performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances speed and efficiency in processing instructions, suitable for real-time applications.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for fast operation and real-time processing of data.

No. of Timers: 5

Multiple timers provide timing and scheduling capabilities for various applications and tasks.

RAM Bytes: 1024

A generous amount of RAM memory for data storage and manipulation, enhancing the microcontroller's performance.

Analog To Digital Convertors: 14-Ch 10-Bit

Multiple ADC channels with high resolution allow for accurate conversion of analog signals into digital data.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

Various communication interfaces offer versatile connectivity options for interfacing with other devices and systems.

Low Power Mode: YES

Enables energy-efficient operation by reducing power consumption during idle or low-demand periods.

Speed: 24 rpm

Capable of processing data at high speeds, suitable for applications requiring quick response times.

No. of I/O Lines: 32

Sufficient I/O lines for interfacing with external components and peripherals, enhancing the microcontroller's versatility.

Technical Specifications

Microcontrollers MSP430FR5721IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

4096

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

MSP430FR5721IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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