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MSP430FR4132IPMR

Texas Instruments

MSP430FR4132IPMR by Texas Instruments

MSP430FR4132IPMR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring low power consumption. Features include 10 ADC channels, PWM support, and connectivity options like I2C, IRDA, SCI(2), SPI(2), UART.

Median Price

$1.547

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,493 parts In-Stock

1+ parts

$1.547

100+ parts

$1.356

1k+ parts

$0.766

10k+ parts

-

16,493

$1.547

$1.356

$0.766

-

Mouser Electronics

USA . 540 parts In-Stock

1+ parts

$2.820

100+ parts

$1.720

1k+ parts

$1.210

10k+ parts

$1.170

540

$2.820

$1.720

$1.210

$1.170

Chip1Stop

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.923

10k+ parts

-

1,000

-

-

$0.923

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 500 parts In-Stock

1+ parts

$1.470

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.470

-

-

-

Vyrian

USA . 6,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,102

-

-

-

-

Semtec, LLC

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 108 parts In-Stock

1+ parts

$1.392

100+ parts

-

1k+ parts

-

10k+ parts

-

108

$1.392

-

-

-

Component Stockers USA

USA . 12,877 parts In-Stock

1+ parts

$2.250

100+ parts

$1.620

1k+ parts

$0.820

10k+ parts

$0.820

12,877

$2.250

$1.620

$0.820

$0.820

Parana Technologies

USA . 2,255 parts In-Stock

1+ parts

$15.769

100+ parts

-

1k+ parts

$16.129

10k+ parts

-

2,255

$15.769

-

$16.129

-

ChromeModa Solutions

Germany . 2,211 parts In-Stock

1+ parts

$17.718

100+ parts

$14.529

1k+ parts

-

10k+ parts

-

2,211

$17.718

$14.529

-

-

IDEA Electronic Components Group

UK . 2,161 parts In-Stock

1+ parts

$17.718

100+ parts

$16.832

1k+ parts

$15.946

10k+ parts

-

2,161

$17.718

$16.832

$15.946

-

iodParts Technologies Inc.

India . 2,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,041

-

-

-

-

DigiPath Technology Company

USA . 771 parts In-Stock

1+ parts

-

100+ parts

$15.975

1k+ parts

-

10k+ parts

-

771

-

$15.975

-

-

Overview

Experience the power of innovation with the Texas Instruments MSP430FR4132IPMR microcontroller. Built by a trusted manufacturer, this device offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides customers with exceptional value, benefits, and advantages. Explore new possibilities and unleash your creativity with the MSP430FR4132IPMR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage enables the microcontroller to support a wide range of external components and peripherals.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage within the microcontroller.

Package Shape: SQUARE

Square package shape enables easy integration into various PCB layouts and designs.

Bit Size: 16

16-bit architecture provides enhanced processing power and higher data handling capabilities.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows for flexibility in power management and energy efficiency.

No. of Terminals: 64

64 terminals provide ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style ensures space-saving and compact design for electronic applications.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range makes the microcontroller suitable for industrial applications with demanding environmental conditions.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption, making it suitable for battery-operated devices and IoT applications.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows the microcontroller to function in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures reliable electrical connections and corrosion resistance for long-term performance.

ADC Channels: YES

Integrated ADC channels enable analog-to-digital conversion, essential for sensor interfacing and data acquisition applications.

Terminal Position: QUAD

Quad terminal position provides a secure and stable mounting option on the PCB, minimizing the risk of disconnection or damage.

ROM Words: 8192

Large ROM capacity of 8192 words allows for storing program instructions and data for efficient operation of the microcontroller.

Maximum Seated Height: 1.6 mm

Low maximum seated height enables a slim and compact form factor for space-constrained applications.

Width: 10 mm

Compact width of 10mm facilitates easy integration of the microcontroller into various electronic devices and systems.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the microcontroller during the manufacturing process.

Peripherals: 'BOR, CRC, LCD, RTC, TIMER(3), WDT'

Rich set of peripherals including BOR, CRC, LCD, RTC, TIMER(3), and WDT enhance the functionality and versatility of the microcontroller for diverse applications.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16 MHz ensures fast and efficient execution of instructions for real-time processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature of 30 seconds allows for effective soldering and bonding of the microcontroller to the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper melting and reflow of solder paste for reliable solder joints.

Length: 10 mm

Compact length of 10mm contributes to the overall small footprint of the microcontroller, ideal for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation of the microcontroller in harsh environmental conditions and critical applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient and streamlined processing for faster response times and reduced power consumption.

RAM Bytes: 1024

Substantial RAM capacity of 1024 bytes allows for temporary data storage and efficient multitasking capabilities for the microcontroller.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form offers reliable solder connections and ease of assembly during the manufacturing process.

Analog To Digital Convertors: 10-Ch 10-Bit

10-channel 10-bit ADCs enable precise analog signal conversion for accurate sensor data acquisition and processing.

Maximum Supply Current: 3.7 mA

Low maximum supply current of 3.7 mA helps in reducing power consumption and extending the battery life of portable devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the microcontroller under normal operating conditions.

PWM Channels: YES

PWM channels allow for precise control of output signals, essential for applications like motor control, LED dimming, and power management.

Connectivity: 'I2C, IRDA, SCI(2), SPI(2), UART'

Diverse connectivity options including I2C, IRDA, SCI(2), SPI(2), and UART enable seamless communication with external devices and peripherals.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility for updating firmware and software, ensuring scalability and adaptability of the microcontroller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density integration on the PCB, conserving space and enabling complex circuit designs.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and data processing, improving computational efficiency for the microcontroller.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller has moderate sensitivity to moisture, requiring proper handling during storage and assembly.

Speed: 16 rpm

High speed of 16rpm allows for rapid processing and execution of tasks, making the microcontroller suitable for time-critical applications.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or standby periods, maximizing energy efficiency.

On Chip Program ROM Width: 8

8-bit program ROM width enables efficient storage of program instructions, enhancing the overall performance of the microcontroller.

No. of I/O Lines: 60

60 I/O lines provide ample flexibility for interfacing with external devices, sensors, and peripherals, expanding the functionality of the microcontroller.

Technical Specifications

Microcontrollers MSP430FR4132IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Terminals:

64

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, CRC, LCD, RTC, TIMER(3), WDT"

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

MSP430FR4132IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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