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MSP430FR4132IG56

Texas Instruments

MSP430FR4132IG56 by Texas Instruments

MSP430FR4132IG56 by Texas Instruments is a 16-bit microcontroller with 8KB ROM, 1KB RAM, and 8 ADC channels. Ideal for industrial applications, it operates at up to 16MHz with low power mode support and offers various peripherals like BOR, CRC, LCD, RTC, TIMER(3), WDT for connectivity via I2C, IRDA, SCI(2), SPI(2), UART interfaces.

Median Price

$2.269

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,750 parts In-Stock

1+ parts

$1.818

100+ parts

$1.593

1k+ parts

$0.900

10k+ parts

-

20,750

$1.818

$1.593

$0.900

-

DigiKey

USA . 191 parts In-Stock

1+ parts

$2.720

100+ parts

$1.800

1k+ parts

$1.657

10k+ parts

-

191

$2.720

$1.800

$1.657

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,220 parts In-Stock

1+ parts

$1.727

100+ parts

-

1k+ parts

-

10k+ parts

-

3,220

$1.727

-

-

-

Vyrian

USA . 6,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,331

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,385 parts In-Stock

1+ parts

$1.550

100+ parts

-

1k+ parts

-

10k+ parts

-

10,385

$1.550

-

-

-

Corphita

USA . 4,377 parts In-Stock

1+ parts

$1.636

100+ parts

-

1k+ parts

-

10k+ parts

-

4,377

$1.636

-

-

-

Component Stockers USA

USA . 321 parts In-Stock

1+ parts

$2.620

100+ parts

$1.900

1k+ parts

-

10k+ parts

-

321

$2.620

$1.900

-

-

Microchip USA

USA . 2,216 parts In-Stock

1+ parts

$17.420

100+ parts

$17.310

1k+ parts

$17.260

10k+ parts

$17.210

2,216

$17.420

$17.310

$17.260

$17.210

Parana Technologies

USA . 1,542 parts In-Stock

1+ parts

$18.241

100+ parts

-

1k+ parts

$18.376

10k+ parts

-

1,542

$18.241

-

$18.376

-

ChromeModa Solutions

Germany . 6,855 parts In-Stock

1+ parts

$20.495

100+ parts

$16.806

1k+ parts

-

10k+ parts

-

6,855

$20.495

$16.806

-

-

IDEA Electronic Components Group

UK . 270 parts In-Stock

1+ parts

$20.495

100+ parts

$19.470

1k+ parts

$18.446

10k+ parts

-

270

$20.495

$19.470

$18.446

-

DigiPath Technology Company

USA . 251 parts In-Stock

1+ parts

-

100+ parts

$18.478

1k+ parts

-

10k+ parts

-

251

-

$18.478

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430FR4132IG56 microcontroller. Known for its top-notch quality, this device offers unparalleled performance and reliability. Ideal for a wide range of applications in industrial settings, this microcontroller provides customers with value-added benefits such as low power consumption, high processing speed, and versatile connectivity options. Trust Texas Instruments to deliver cutting-edge technology that empowers innovation and efficiency in your projects. Elevate your designs with the MSP430FR4132IG56 - the ultimate choice for microcontroller solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, making the microcontroller versatile in different applications.

No. of Terminals: 56

Offers a sufficient number of terminals for connecting external components and peripherals, enhancing the microcontroller's connectivity.

ADC Channels: YES

Integration of Analog to Digital Converters allows for accurate conversion of analog signals, making the microcontroller suitable for sensor interfacing.

Peripherals: BOR, CRC, LCD, RTC, TIMER(3), WDT

Comprehensive set of peripherals enhances the functionality of the microcontroller, enabling it to perform a wide range of tasks efficiently.

PWM Channels: YES

Pulse Width Modulation channels support precise control of analog circuits, making the microcontroller ideal for applications requiring motor control or LED dimming.

Connectivity: I2C, IRDA, SCI(2), SPI(2), UART

Multiple connectivity options enable the microcontroller to communicate with various devices, facilitating seamless data exchange and networking.

Technical Specifications

Microcontrollers MSP430FR4132IG56 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Terminals:

56

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, CRC, LCD, RTC, TIMER(3), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR4132IG56 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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