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MSP430FR2673TRHBT

Texas Instruments

MSP430FR2673TRHBT by Texas Instruments

MSP430FR2673TRHBT by Texas Instruments is a 16-bit microcontroller with 2048 RAM words and 16384 ROM words. It operates at a max clock frequency of 0.032 MHz, making it ideal for industrial applications requiring low power consumption and high-speed processing. With peripherals like BOR, PWM, and RTC, this chip offers versatile connectivity options through I2C, IRDA, SPI, and UART interfaces.

Median Price

$3.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,248 parts In-Stock

1+ parts

$3.519

100+ parts

$3.083

1k+ parts

$1.742

10k+ parts

-

22,248

$3.519

$3.083

$1.742

-

DigiKey

USA . 681 parts In-Stock

1+ parts

$4.460

100+ parts

$2.822

1k+ parts

$2.596

10k+ parts

-

681

$4.460

$2.822

$2.596

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,534 parts In-Stock

1+ parts

$3.343

100+ parts

-

1k+ parts

-

10k+ parts

-

3,534

$3.343

-

-

-

Vyrian

USA . 5,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,753

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,233 parts In-Stock

1+ parts

$3.167

100+ parts

-

1k+ parts

-

10k+ parts

-

3,233

$3.167

-

-

-

Parana Technologies

USA . 2,001 parts In-Stock

1+ parts

$27.329

100+ parts

-

1k+ parts

$34.637

10k+ parts

-

2,001

$27.329

-

$34.637

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DigiPath Technology Company

USA . 230 parts In-Stock

1+ parts

$30.093

100+ parts

-

1k+ parts

-

10k+ parts

-

230

$30.093

-

-

-

ChromeModa Solutions

Germany . 2,410 parts In-Stock

1+ parts

$30.707

100+ parts

$25.180

1k+ parts

-

10k+ parts

-

2,410

$30.707

$25.180

-

-

IDEA Electronic Components Group

UK . 1,553 parts In-Stock

1+ parts

$30.707

100+ parts

$29.172

1k+ parts

$27.636

10k+ parts

-

1,553

$30.707

$29.172

$27.636

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

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Overview

Unlock the power of cutting-edge technology with the MSP430FR2673TRHBT by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers unparalleled quality and reliability. This versatile chip is perfect for a wide range of applications, offering advanced features and impressive performance. With low power modes and high-speed operation, this microcontroller provides exceptional value and benefits to customers looking to innovate and elevate their projects. Experience the difference with the MSP430FR2673TRHBT and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the product and making it more compact.

Maximum Supply Voltage: 3.6 V

This high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it an ideal choice for battery-powered or energy-efficient applications.

ADC Channels: YES

The presence of Analog to Digital Converter (ADC) channels allows for accurate conversion of analog signals to digital data, enabling a wider range of sensing and control capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computer (RISC) architecture, this product offers efficient execution of instructions and faster processing speed.

Analog To Digital Convertors: 8-Ch 12-Bit

With 8 channels and 12-bit resolution, the Analog to Digital Converters (ADCs) provide precise and detailed conversion of analog signals, ensuring accurate measurement and control.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2)

The multiple connectivity options including I2C, IRDA, SPI, and UART allow for versatile communication with external devices, sensors, and peripherals, enhancing the product's overall flexibility and compatibility.

Low Power Mode: YES

The presence of a low power mode helps in reducing power consumption during idle or low activity periods, extending battery life and overall energy efficiency.

Technical Specifications

Microcontrollers MSP430FR2673TRHBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

27

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

16384

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

3.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR, POR, PWM, RTC, TIMER(6), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR2673TRHBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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