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MSP430FR2633IYQWT

Texas Instruments

MSP430FR2633IYQWT by Texas Instruments

MSP430FR2633IYQWT by Texas Instruments is a 16-bit microcontroller with 8-Ch 10-Bit ADC channels, 4096 bytes RAM, and 15872 ROM words. It operates at up to 16 MHz clock frequency and features BOR, RTC, TIMER(5), WDT peripherals. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$3.501

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,320 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,320

$1.380

-

-

-

Texas Instruments

USA . 2,250 parts In-Stock

1+ parts

$3.501

100+ parts

$2.892

1k+ parts

$1.563

10k+ parts

-

2,250

$3.501

$2.892

$1.563

-

Mouser Electronics

USA . 379 parts In-Stock

1+ parts

$4.310

100+ parts

$2.620

1k+ parts

$2.120

10k+ parts

-

379

$4.310

$2.620

$2.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,119 parts In-Stock

1+ parts

$3.326

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$3.326

-

-

-

Vyrian

USA . 3,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,914

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,320 parts In-Stock

1+ parts

$1.240

100+ parts

-

1k+ parts

-

10k+ parts

-

1,320

$1.240

-

-

-

Corphita

USA . 2,490 parts In-Stock

1+ parts

$3.151

100+ parts

-

1k+ parts

-

10k+ parts

-

2,490

$3.151

-

-

-

Parana Technologies

USA . 2,013 parts In-Stock

1+ parts

$14.017

100+ parts

-

1k+ parts

$14.488

10k+ parts

-

2,013

$14.017

-

$14.488

-

DigiPath Technology Company

USA . 1,962 parts In-Stock

1+ parts

$15.434

100+ parts

$14.199

1k+ parts

-

10k+ parts

-

1,962

$15.434

$14.199

-

-

IDEA Electronic Components Group

UK . 2,304 parts In-Stock

1+ parts

$15.749

100+ parts

$14.962

1k+ parts

$14.174

10k+ parts

-

2,304

$15.749

$14.962

$14.174

-

ChromeModa Solutions

Germany . 63 parts In-Stock

1+ parts

$15.749

100+ parts

$12.914

1k+ parts

-

10k+ parts

-

63

$15.749

$12.914

-

-

Microchip USA

USA . 1,238 parts In-Stock

1+ parts

$18.980

100+ parts

$18.870

1k+ parts

$18.810

10k+ parts

$18.750

1,238

$18.980

$18.870

$18.810

$18.750

A-Z Elektronik GmbH

Germany . 6,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,143

-

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430FR2633IYQWT microcontroller. Designed with cutting-edge technology and precision craftsmanship, this device offers unparalleled performance and reliability. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller is a game-changer in the world of embedded systems. Experience seamless connectivity and efficient power management with the MSP430 family, setting new standards in innovation. Elevate your projects with the quality and value that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount technology makes it easy to integrate the microcontroller into PCBs, saving space and allowing for automated assembly.

Maximum Supply Voltage: 3.6 V

The ability to operate at up to 3.6V allows for flexibility in power supply options.

Bit Size: 16

16-bit architecture provides higher computational power compared to 8-bit microcontrollers, suitable for more complex applications.

ADC Channels: YES

Integrated Analog to Digital Converters (ADC) enable the microcontroller to interface with analog sensors, expanding its compatibility with various devices.

ROM Words: 15872

Large ROM capacity allows for storing a significant amount of program data, enabling the microcontroller to handle sophisticated algorithms and functions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture ensures efficient processing of instructions, improving overall performance of the microcontroller.

RAM Bytes: 4096

A generous amount of Random Access Memory (RAM) enables the microcontroller to handle data processing and temporary storage effectively.

Speed: 16 rpm

Operating at 16 rpm allows for swift execution of commands and tasks, ensuring responsive performance in real-time applications.

Technical Specifications

Microcontrollers MSP430FR2633IYQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B24

JESD-609 Code:

e1

Length:

2.34 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

19

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

15872

ROM Programmability:

FRAM

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.29 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA(2), SPI(3), UART(2)

Peripherals:

BOR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2633IYQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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