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MSP430FR2632IYQWR

Texas Instruments

MSP430FR2632IYQWR by Texas Instruments

MSP430FR2632IYQWR by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM and 8704 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring BOR, RTC, TIMER(5), WDT peripherals. The chip features 8-Ch 10-Bit ADC channels and FRAM ROM programmability for efficient data storage and processing.

Median Price

$1.864

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,300 parts In-Stock

1+ parts

$1.864

100+ parts

$1.539

1k+ parts

$0.832

10k+ parts

-

1,300

$1.864

$1.539

$0.832

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,854 parts In-Stock

1+ parts

$1.771

100+ parts

-

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1,854

$1.771

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Vyrian

USA . 7,913 parts In-Stock

1+ parts

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7,913

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Distributors (Availability)

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Corphita

USA . 4,270 parts In-Stock

1+ parts

$1.678

100+ parts

-

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4,270

$1.678

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Microchip USA

USA . 5,692 parts In-Stock

1+ parts

$8.514

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5,692

$8.514

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$18.408

100+ parts

$16.751

1k+ parts

$15.095

10k+ parts

-

100

$18.408

$16.751

$15.095

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AZTECH Wire

Italy . 956 parts In-Stock

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$19.500

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956

$19.500

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Parana Technologies

USA . 1,305 parts In-Stock

1+ parts

$74.157

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1,305

$74.157

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DigiPath Technology Company

USA . 2,228 parts In-Stock

1+ parts

$81.656

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2,228

$81.656

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ChromeModa Solutions

Germany . 4,157 parts In-Stock

1+ parts

$83.322

100+ parts

$68.324

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4,157

$83.322

$68.324

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

1+ parts

$83.322

100+ parts

$79.156

1k+ parts

$74.990

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1,675

$83.322

$79.156

$74.990

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iodParts Technologies Inc.

India . 247 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430FR2632IYQWR microcontroller. Built by a trusted manufacturer, this device is at the forefront of innovation in the microcontroller category. With its compact size and advanced features, it offers unparalleled value to customers looking to streamline their projects. From IoT applications to consumer electronics, this versatile microcontroller is the key to bringing your ideas to life. Embrace the power of Texas Instruments and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, saving space and making the manufacturing process more efficient.

Maximum Supply Voltage: 3.6 V

Ability to operate at a maximum supply voltage of 3.6 V makes this microcontroller suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during assembly process.

Bit Size: 16

16-bit architecture allows for higher processing capabilities and more complex tasks to be handled efficiently.

No. of Terminals: 24

Having 24 terminals provides flexibility for interfacing with external components and peripherals.

ADC Channels: YES

Analog to Digital Convertor channels enable the microcontroller to interface with analog sensors, expanding its application range.

ROM Words: 8704

Large ROM capacity of 8704 words allows for storing of program instructions and data for complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture provides efficient and streamlined operation for faster performance.

RAM Bytes: 2048

2048 bytes of RAM enables temporary data storage for efficient processing of instructions and data manipulation.

Connectivity: I2C, IRDA(2), SPI(2), UART(2)

Multiple connectivity options such as I2C, IRDA, SPI, and UART make it versatile for communication with other devices.

Technical Specifications

Microcontrollers MSP430FR2632IYQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B24

JESD-609 Code:

e1

Length:

2.34 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

15

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

8704

ROM Programmability:

FRAM

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.29 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA(2), SPI(2), UART(2)

Peripherals:

BOR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2632IYQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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