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MSP430FR2632IRGET

Texas Instruments

MSP430FR2632IRGET by Texas Instruments

MSP430FR2632IRGET by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM and 8704 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring BOR, RTC, TIMER(5), and WDT peripherals. The chip carrier package has a square shape with very thin profile and terminal pitch of 0.5 mm.

Median Price

$2.520

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,750 parts In-Stock

1+ parts

$2.484

100+ parts

$2.052

1k+ parts

$1.109

10k+ parts

-

9,750

$2.484

$2.052

$1.109

-

DigiKey

USA . 558 parts In-Stock

1+ parts

$2.980

100+ parts

$2.040

1k+ parts

$1.676

10k+ parts

-

558

$2.980

$2.040

$1.676

-

Mouser Electronics

USA . 436 parts In-Stock

1+ parts

$2.980

100+ parts

$2.040

1k+ parts

$1.630

10k+ parts

$1.540

436

$2.980

$2.040

$1.630

$1.540

Farnell

UK . 266 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.160

10k+ parts

-

266

-

$1.240

$1.160

-

Element14

Singapore . 266 parts In-Stock

1+ parts

-

100+ parts

$2.520

1k+ parts

-

10k+ parts

-

266

-

$2.520

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.660

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.660

-

-

-

Digiode

USA . 2,010 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

-

10k+ parts

-

2,010

$2.360

-

-

-

Vyrian

USA . 4,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,875

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,016 parts In-Stock

1+ parts

$1.050

100+ parts

-

1k+ parts

-

10k+ parts

-

2,016

$1.050

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.660

100+ parts

$1.627

1k+ parts

-

10k+ parts

-

1,000

$1.660

$1.627

-

-

Continental Prestige Electronics

USA . 266 parts In-Stock

1+ parts

$1.990

100+ parts

$1.470

1k+ parts

-

10k+ parts

-

266

$1.990

$1.470

-

-

Corphita

USA . 1,586 parts In-Stock

1+ parts

$2.236

100+ parts

-

1k+ parts

-

10k+ parts

-

1,586

$2.236

-

-

-

Component Stockers USA

USA . 8,194 parts In-Stock

1+ parts

$2.920

100+ parts

$2.150

1k+ parts

$1.200

10k+ parts

-

8,194

$2.920

$2.150

$1.200

-

Microchip USA

USA . 2,682 parts In-Stock

1+ parts

$13.470

100+ parts

$13.390

1k+ parts

$13.350

10k+ parts

$13.310

2,682

$13.470

$13.390

$13.350

$13.310

Parana Technologies

USA . 1,603 parts In-Stock

1+ parts

$75.040

100+ parts

-

1k+ parts

-

10k+ parts

-

1,603

$75.040

-

-

-

DigiPath Technology Company

USA . 322 parts In-Stock

1+ parts

$82.629

100+ parts

$76.018

1k+ parts

-

10k+ parts

-

322

$82.629

$76.018

-

-

ChromeModa Solutions

Germany . 5,613 parts In-Stock

1+ parts

$84.315

100+ parts

$69.138

1k+ parts

-

10k+ parts

-

5,613

$84.315

$69.138

-

-

IDEA Electronic Components Group

UK . 1,661 parts In-Stock

1+ parts

$84.315

100+ parts

$80.099

1k+ parts

$75.884

10k+ parts

-

1,661

$84.315

$80.099

$75.884

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Unlock unparalleled performance and efficiency with the Texas Instruments MSP430FR2632IRGET microcontroller. Renowned for its top-notch quality and cutting-edge technology, Texas Instruments delivers a game-changing solution for a wide range of applications in the microcontroller category. Experience seamless connectivity and versatile functionality with this innovative product, offering customers unmatched value, benefits, and advantages. Stay ahead of the curve and elevate your projects with the MSP430FR2632IRGET by Texas Instruments.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy integration onto circuit boards.

Maximum Supply Voltage:

3.6 V - Offers flexibility in power requirements.

Package Shape:

SQUARE - Helps save space and increase efficiency in design.

Bit Size:

16 - Provides sufficient processing power for various applications.

No. of Terminals:

24 - Offers versatility in connections and interfaces.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Ensures efficient heat dissipation in a compact form.

Minimum Supply Voltage:

1.8 V - Suitable for low-power applications.

Maximum Operating Temperature:

85 °C - Can withstand high operating temperatures.

CPU Family:

MSP430 - Known for its low power consumption and high performance.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme environments.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Ensures reliable and corrosion-resistant connections.

ADC Channels:

YES - Enables analog-to-digital conversion for sensor integration.

Terminal Position:

QUAD - Facilitates easy soldering on PCBs.

ROM Words:

8704 - Sufficient memory for storing program instructions and data.

Maximum Seated Height:

1 mm - Enables compact designs for space-constrained applications.

Width:

4 mm - Slim form factor for small electronic devices.

Peripherals:

BOR, RTC, TIMER(5), WDT - Offers additional functions for enhanced system capabilities.

Maximum Clock Frequency:

16 MHz - Provides high-speed processing capabilities.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C:

260 - Allows for reliable soldering processes.

Length:

4 mm - Compact size for space-efficient designs.

Temperature Grade:

INDUSTRIAL - Suitable for industrial-grade applications.

Peripheral IC Type:

MICROCONTROLLER, RISC - Features a powerful and efficient microcontroller architecture.

RAM Bytes:

2048 - Sufficient memory for data storage and processing.

Technology:

CMOS - Offers low power consumption and high noise immunity.

Terminal Form:

NO LEAD - Environmentally friendly and easy to handle during assembly.

Analog To Digital Convertors:

8-Ch 10-Bit - Provides multi-channel ADC for versatile sensor interfacing.

Nominal Supply Voltage:

2 V - Ideal for low-power applications.

PWM Channels:

YES - Enables precise control of connected devices.

Connectivity:

I2C, IRDA(2), SPI(2), UART(2) - Allows for flexible communication options.

ROM Programmability:

FRAM - Offers fast and reliable non-volatile memory programming.

Terminal Pitch:

0.5 mm - Enables precise and compact PCB layout.

Moisture Sensitivity Level (MSL):

2 - Suitable for a wide range of environmental conditions.

Speed:

16 rpm - Provides fast data processing capabilities.

On Chip Program ROM Width:

8 - Offers wide ROM storage for program instructions.

No. of I/O Lines:

15 - Provides sufficient input/output options for interfacing with external devices.

Technical Specifications

Microcontrollers MSP430FR2632IRGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO HAVING 512 BYTES OF INFORMATION FRAM

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

15

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

8704

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA(2), SPI(2), UART(2)

Peripherals:

BOR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2632IRGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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