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MSP430FR2533IDAR

Texas Instruments

MSP430FR2533IDAR by Texas Instruments

MSP430FR2533IDAR by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM and 15872 ROM words. It operates at a max frequency of 16 MHz, has 8 ADC channels, and supports PWM output. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$2.204

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 73,675 parts In-Stock

1+ parts

$2.204

100+ parts

$1.931

1k+ parts

$1.091

10k+ parts

-

73,675

$2.204

$1.931

$1.091

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 37 parts In-Stock

1+ parts

$1.212

100+ parts

-

1k+ parts

-

10k+ parts

-

37

$1.212

-

-

-

Digiode

USA . 3,107 parts In-Stock

1+ parts

$2.094

100+ parts

-

1k+ parts

-

10k+ parts

-

3,107

$2.094

-

-

-

Vyrian

USA . 4,642 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,642

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,355 parts In-Stock

1+ parts

$1.212

100+ parts

-

1k+ parts

-

10k+ parts

-

2,355

$1.212

-

-

-

Continental Prestige Electronics

USA . 1,354 parts In-Stock

1+ parts

$1.212

100+ parts

-

1k+ parts

-

10k+ parts

$1.188

1,354

$1.212

-

-

$1.188

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.212

100+ parts

-

1k+ parts

$1.151

10k+ parts

$1.127

100

$1.212

-

$1.151

$1.127

Ampacity Inc.

Singapore . 73,361 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

-

73,361

$1.870

-

-

-

Corphita

USA . 2,498 parts In-Stock

1+ parts

$1.984

100+ parts

-

1k+ parts

-

10k+ parts

-

2,498

$1.984

-

-

-

Microchip USA

USA . 1,089 parts In-Stock

1+ parts

$9.526

100+ parts

-

1k+ parts

-

10k+ parts

-

1,089

$9.526

-

-

-

AZTECH Wire

Italy . 1,133 parts In-Stock

1+ parts

$10.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,133

$10.910

-

-

-

Parana Technologies

USA . 343 parts In-Stock

1+ parts

$55.684

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$55.684

-

-

-

DigiPath Technology Company

USA . 576 parts In-Stock

1+ parts

$61.315

100+ parts

-

1k+ parts

-

10k+ parts

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576

$61.315

-

-

-

ChromeModa Solutions

Germany . 4,558 parts In-Stock

1+ parts

$62.566

100+ parts

$51.304

1k+ parts

-

10k+ parts

-

4,558

$62.566

$51.304

-

-

IDEA Electronic Components Group

UK . 2,127 parts In-Stock

1+ parts

$62.566

100+ parts

$59.438

1k+ parts

$56.309

10k+ parts

-

2,127

$62.566

$59.438

$56.309

-

Overview

Unlock the endless possibilities with the MSP430FR2533IDAR microcontroller by Texas Instruments. Built with high-quality materials and advanced technology, this device offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, the MSP430FR2533IDAR delivers efficient connectivity, precise control, and low power consumption. Experience the value and benefits of this innovative solution, designed to empower your projects and drive success. Elevate your designs with Texas Instruments' renowned expertise and unleash the full potential of your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The package body material being plastic/epoxy makes the product durable and resistant to damage, ensuring longevity.

Surface Mount: YES

The surface mount feature allows for easy and compact integration onto PCBs, saving space and making it suitable for small form factor designs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can operate efficiently with various power sources without risking damage.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy installation and compatibility with existing designs.

Bit Size: 16

The 16-bit architecture allows for higher precision and performance in processing data and instructions compared to lower bit sizes.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with other components and peripherals in a system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style offer space-saving benefits and increased flexibility in PCB layout design.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage of 1.8V allows for efficient power consumption and operation in battery-powered applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand high temperature environments without performance degradation.

CPU Family: MSP430

The MSP430 CPU family is known for its low-power consumption and high-performance capabilities, making it suitable for energy-efficient applications.

Technical Specifications

Microcontrollers MSP430FR2533IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO HAVING 512 BYTES OF INFORMATION FRAM

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

19

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

15872

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA(2), SPI(3), UART(2)

Peripherals:

BOR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2533IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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