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MSP430FR2512IRHLT

Texas Instruments

MSP430FR2512IRHLT by Texas Instruments

MSP430FR2512IRHLT by Texas Instruments is a 16-bit microcontroller with 8-Ch 10-Bit ADC channels, 2048 bytes RAM, and FRAM ROM programmability. It operates b/w -40 to 85 °C, suitable for industrial applications requiring low power consumption and high-speed processing. With PWM channels, BOR, RTC, TIMER(2), WDT peripherals, it offers versatile connectivity options like EUSCI(2) for efficient system integration.

Median Price

$2.250

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,746 parts In-Stock

1+ parts

$1.812

100+ parts

$1.497

1k+ parts

$0.809

10k+ parts

-

12,746

$1.812

$1.497

$0.809

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Mouser Electronics

USA . 455 parts In-Stock

1+ parts

$2.250

100+ parts

$1.360

1k+ parts

$1.210

10k+ parts

$1.160

455

$2.250

$1.360

$1.210

$1.160

DigiKey

USA . 308 parts In-Stock

1+ parts

$2.250

100+ parts

$1.359

1k+ parts

$1.237

10k+ parts

-

308

$2.250

$1.359

$1.237

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.400

100+ parts

-

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-

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10

$1.400

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Digiode

USA . 1,877 parts In-Stock

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$1.721

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1,877

$1.721

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Chip Stock

USA . 49,058 parts In-Stock

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49,058

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Vyrian

USA . 4,081 parts In-Stock

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4,081

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,435 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

-

10k+ parts

$1.372

6,435

$1.400

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-

$1.372

Argo Parts USA

USA . 4,957 parts In-Stock

1+ parts

$1.400

100+ parts

-

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4,957

$1.400

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.400

100+ parts

-

1k+ parts

$1.330

10k+ parts

$1.302

1,000

$1.400

-

$1.330

$1.302

Ampacity Inc.

Singapore . 4,407 parts In-Stock

1+ parts

$1.540

100+ parts

-

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4,407

$1.540

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Corphita

USA . 2,415 parts In-Stock

1+ parts

$1.631

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2,415

$1.631

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Parana Technologies

USA . 1,549 parts In-Stock

1+ parts

$42.819

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1,549

$42.819

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DigiPath Technology Company

USA . 1,146 parts In-Stock

1+ parts

$47.149

100+ parts

$43.377

1k+ parts

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1,146

$47.149

$43.377

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ChromeModa Solutions

Germany . 6,415 parts In-Stock

1+ parts

$48.111

100+ parts

$39.451

1k+ parts

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6,415

$48.111

$39.451

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IDEA Electronic Components Group

UK . 333 parts In-Stock

1+ parts

$48.111

100+ parts

$45.705

1k+ parts

$43.300

10k+ parts

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333

$48.111

$45.705

$43.300

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Lixinc

USA . 9,721 parts In-Stock

1+ parts

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9,721

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Overview

Unlock the power of innovative technology with the Texas Instruments MSP430FR2512IRHLT microcontroller. Designed with precision and quality in mind, this chip offers unparalleled performance for a variety of applications. From industrial automation to consumer electronics, this microcontroller provides reliable connectivity, advanced peripherals, and efficient power management. Experience the value and benefits of cutting-edge CMOS technology in a compact and durable package. Trust Texas Instruments to deliver excellence in every component, bringing your projects to life with seamless integration and superior functionality. Choose the MSP430FR2512IRHLT for unmatched reliability and performance in your next design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Highly durable and lightweight material, suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with various power sources, providing flexibility in design.

Bit Size: 16

Provides sufficient processing power for handling complex tasks efficiently.

RAM Bytes: 2048

Ample memory capacity for storing and processing data effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with extended temperature range and reliability.

Connectivity: EUSCI(2)

Enhanced UART/SPI/I2C communication interfaces for seamless connectivity with other devices.

ROM Programmability: FRAM

Ferroelectric RAM technology offers fast read/write access with non-volatile memory capabilities.

Technical Specifications

Microcontrollers MSP430FR2512IRHLT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

7680

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Peripheral IC Type:

Connectivity:

EUSCI(2)

Peripherals:

BOR, RTC, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2512IRHLT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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