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MSP430FR2422IPW16

Texas Instruments

MSP430FR2422IPW16 by Texas Instruments

MSP430FR2422IPW16 by Texas Instruments is a 16-bit microcontroller with 7680 ROM words and 2048 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring BOR, POR, RTC, and PWM functionalities. With I2C, IRDA, SCI(2), SPI(2), and UART connectivity options, it offers versatile integration capabilities in compact dimensions.

Median Price

$1.077

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 124,948 parts In-Stock

1+ parts

$1.077

100+ parts

$0.890

1k+ parts

$0.481

10k+ parts

-

124,948

$1.077

$0.890

$0.481

-

Mouser Electronics

USA . 404 parts In-Stock

1+ parts

$1.860

100+ parts

$1.050

1k+ parts

$0.825

10k+ parts

$0.753

404

$1.860

$1.050

$0.825

$0.753

Arrow

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$0.701

1k+ parts

-

10k+ parts

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90

-

$0.701

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.866

100+ parts

-

1k+ parts

-

10k+ parts

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500

$0.866

-

-

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Digiode

USA . 1,892 parts In-Stock

1+ parts

$1.023

100+ parts

-

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-

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1,892

$1.023

-

-

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Chip Stock

USA . 15,500 parts In-Stock

1+ parts

-

100+ parts

-

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15,500

-

-

-

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Vyrian

USA . 5,698 parts In-Stock

1+ parts

-

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5,698

-

-

-

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TME

Poland . 90 parts In-Stock

1+ parts

-

100+ parts

$1.015

1k+ parts

-

10k+ parts

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90

-

$1.015

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 41,549 parts In-Stock

1+ parts

$0.680

100+ parts

-

1k+ parts

-

10k+ parts

-

41,549

$0.680

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$0.848

100+ parts

-

1k+ parts

$0.815

10k+ parts

-

1,000

$0.848

-

$0.815

-

Argo Parts USA

USA . 3,646 parts In-Stock

1+ parts

$0.866

100+ parts

-

1k+ parts

-

10k+ parts

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3,646

$0.866

-

-

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Continental Prestige Electronics

USA . 58 parts In-Stock

1+ parts

$0.866

100+ parts

-

1k+ parts

-

10k+ parts

$0.848

58

$0.866

-

-

$0.848

Advanced Electronics

New Zealand . 82 parts In-Stock

1+ parts

$0.883

100+ parts

$0.883

1k+ parts

$0.883

10k+ parts

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82

$0.883

$0.883

$0.883

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Corphita

USA . 1,374 parts In-Stock

1+ parts

$0.969

100+ parts

-

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-

10k+ parts

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1,374

$0.969

-

-

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Corohmni

South Africa . 292 parts In-Stock

1+ parts

$40.861

100+ parts

-

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292

$40.861

-

-

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Parana Technologies

USA . 1,680 parts In-Stock

1+ parts

$72.982

100+ parts

-

1k+ parts

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10k+ parts

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1,680

$72.982

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DigiPath Technology Company

USA . 1,912 parts In-Stock

1+ parts

$80.362

100+ parts

-

1k+ parts

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10k+ parts

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1,912

$80.362

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-

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ChromeModa Solutions

Germany . 2,003 parts In-Stock

1+ parts

$82.002

100+ parts

$67.242

1k+ parts

-

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2,003

$82.002

$67.242

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IDEA Electronic Components Group

UK . 640 parts In-Stock

1+ parts

$82.002

100+ parts

$77.902

1k+ parts

$73.802

10k+ parts

-

640

$82.002

$77.902

$73.802

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Lixinc

USA . 4,762 parts In-Stock

1+ parts

-

100+ parts

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4,762

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A-Z Elektronik GmbH

Germany . 1,620 parts In-Stock

1+ parts

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100+ parts

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1,620

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Overview

Unlock endless possibilities with the Texas Instruments MSP430FR2422IPW16 microcontroller. Crafted with precision and expertise, this versatile device is perfect for a wide range of applications. From consumer electronics to industrial automation, this powerful microcontroller offers unmatched value and performance. Experience seamless connectivity, reliable operation, and efficient power management with the MSP430FR2422IPW16. Trust Texas Instruments to deliver quality products that exceed expectations. Elevate your projects to the next level with the MSP430FR2422IPW16.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it ideal for various working environments.

Surface Mount: YES

Easy installation and space-saving design, perfect for compact electronic devices.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of voltage inputs, increasing compatibility with different power sources.

Package Shape: RECTANGULAR

This shape allows for efficient placement on circuit boards, optimizing space usage.

Bit Size: 16

The 16-bit architecture offers enhanced processing capabilities and performance.

No. of Terminals: 16

Sufficient terminals for connecting external components and peripherals.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style offers a compact form factor, ideal for miniaturized applications.

Minimum Supply Voltage: 1.8 V

Provides flexibility in power requirements while maintaining stable operation.

Maximum Operating Temperature: 85 °C

Suitable for use in industrial settings where higher temperatures may be present.

CPU Family: MSP430

Known for low power consumption and high performance, making it an efficient choice for battery-powered devices.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low-temperature conditions without performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish ensures reliable electrical connections, reducing the risk of signal interference.

ADC Channels: YES

Integrated Analog-to-Digital Converters enable the microcontroller to process analog signals effectively.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit board layout and design.

ROM Words: 7680

Sufficient memory capacity for storing program instructions and data.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Width: 4.4 mm

Compact width ideal for fitting into small electronic devices.

Peripherals: BOR, POR, RTC, TIMER(2), WDT

Multiple integrated peripherals enhance the microcontroller's functionality and versatility.

Maximum Clock Frequency: 16 MHz

High clock frequency for speedy processing of instructions and data.

Maximum Time At Peak Reflow Temperature: 30s

Ensures proper soldering during assembly, reducing the risk of component damage.

Peak Reflow Temperature: 260C

Withstands high-temperature soldering processes without compromising performance.

Length: 5 mm

Compact length suitable for a variety of electronic applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring durability and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture improves processing speed and efficiency of the microcontroller.

RAM Bytes: 2048

Sufficient Random Access Memory for storing data and variables during operation.

Technology: CMOS

Low power consumption and high-speed operation characteristics make it an efficient choice.

Terminal Form: GULL WING

Gull wing terminals provide secure solder connections, ensuring reliable performance.

Analog To Digital Convertors: 5-Ch 10-Bit

Multiple ADC channels for accurately converting analog signals to digital data.

Nominal Supply Voltage: 3 V

Standard voltage level for compatibility with most electronic systems.

PWM Channels: YES

Pulse-Width Modulation channels for precise control of connected devices.

Connectivity: I2C, IRDA, SCI(2), SPI(2), UART

Diverse connectivity options for interfacing with various external devices and systems.

ROM Programmability: FRAM

FRAM technology offers fast, reliable, and energy-efficient programming for the microcontroller's memory.

Terminal Pitch: 0.65 mm

Fine pitch terminals suitable for compact circuit board designs.

Moisture Sensitivity Level: 2

Moderate moisture sensitivity level ensures component reliability under normal environmental conditions.

Speed: 16 rpm

Processing speed of 16 rotations per minute for efficient data handling and computation.

On Chip Program ROM Width: 8

8-bit wide program ROM for storing instructions and data within the microcontroller.

No. of I/O Lines: 15

Sufficient Input/Output lines for connecting external peripherals and sensors.

Technical Specifications

Microcontrollers MSP430FR2422IPW16 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

15

No. of Terminals:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

7680

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SCI(2), SPI(2), UART

Peripherals:

BOR, POR, RTC, TIMER(2), WDT

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430FR2422IPW16 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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