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MSP430FR2355TDBT

Texas Instruments

MSP430FR2355TDBT by Texas Instruments

MSP430FR2355TDBT by Texas Instruments is a 16-bit microcontroller with 10-Ch 12-Bit ADC, 4096 bytes RAM, and FRAM ROM. It operates at up to 24 MHz with I2C, IRADA, SPI, UART connectivity for industrial applications requiring low power consumption and high-speed processing. Package style: Small Outline Thin Profile Shrink Pitch.

Median Price

$4.460

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,933 parts In-Stock

1+ parts

$2.885

100+ parts

$2.352

1k+ parts

$1.568

10k+ parts

-

1,933

$2.885

$2.352

$1.568

-

DigiKey

USA . 194 parts In-Stock

1+ parts

$4.460

100+ parts

$2.821

1k+ parts

$2.525

10k+ parts

$2.451

194

$4.460

$2.821

$2.525

$2.451

Mouser Electronics

USA . 33 parts In-Stock

1+ parts

$4.460

100+ parts

$2.820

1k+ parts

$2.450

10k+ parts

-

33

$4.460

$2.820

$2.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,708 parts In-Stock

1+ parts

$2.741

100+ parts

-

1k+ parts

-

10k+ parts

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2,708

$2.741

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-

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Vyrian

USA . 2,021 parts In-Stock

1+ parts

-

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-

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-

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2,021

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

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-

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 682 parts In-Stock

1+ parts

$2.450

100+ parts

-

1k+ parts

-

10k+ parts

-

682

$2.450

-

-

-

Semicontronic

India . 395 parts In-Stock

1+ parts

$2.450

100+ parts

$2.389

1k+ parts

$2.376

10k+ parts

-

395

$2.450

$2.389

$2.376

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Corphita

USA . 4,170 parts In-Stock

1+ parts

$2.596

100+ parts

-

1k+ parts

-

10k+ parts

-

4,170

$2.596

-

-

-

Parana Technologies

USA . 741 parts In-Stock

1+ parts

$24.560

100+ parts

-

1k+ parts

$25.227

10k+ parts

-

741

$24.560

-

$25.227

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DigiPath Technology Company

USA . 2,223 parts In-Stock

1+ parts

$27.044

100+ parts

$24.881

1k+ parts

-

10k+ parts

-

2,223

$27.044

$24.881

-

-

Microchip USA

USA . 2,675 parts In-Stock

1+ parts

$27.300

100+ parts

$27.130

1k+ parts

$27.050

10k+ parts

$26.960

2,675

$27.300

$27.130

$27.050

$26.960

IDEA Electronic Components Group

UK . 1,711 parts In-Stock

1+ parts

$27.596

100+ parts

$26.216

1k+ parts

$24.836

10k+ parts

-

1,711

$27.596

$26.216

$24.836

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ChromeModa Solutions

Germany . 1,430 parts In-Stock

1+ parts

$27.596

100+ parts

$22.629

1k+ parts

-

10k+ parts

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1,430

$27.596

$22.629

-

-

Corohmni

South Africa . 445 parts In-Stock

1+ parts

$49.435

100+ parts

-

1k+ parts

-

10k+ parts

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445

$49.435

-

-

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Advanced Electronics

New Zealand . 74 parts In-Stock

1+ parts

$64.796

100+ parts

$61.556

1k+ parts

$61.556

10k+ parts

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74

$64.796

$61.556

$61.556

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Lixinc

USA . 15,358 parts In-Stock

1+ parts

-

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15,358

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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3,500

-

-

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Argo Parts USA

USA . 3,283 parts In-Stock

1+ parts

-

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3,283

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-

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

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450

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Continental Prestige Electronics

USA . 228 parts In-Stock

1+ parts

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228

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430FR2355TDBT microcontroller. Known for its superior quality and reliability, Texas Instruments is a leading manufacturer in the industry. This microcontroller, part of the MSP430 family, offers a wide range of applications in various industries. From industrial automation to consumer electronics, the MSP430FR2355TDBT provides unmatched value with its advanced features and capabilities. Experience the benefits of high performance, low power consumption, and seamless connectivity in a compact package. Elevate your designs with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material for the package body makes the product lightweight and durable, helping to ensure reliable performance in various environments.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V allows for flexibility in powering the microcontroller and is suitable for a wide range of applications.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a popular choice for energy-efficient applications.

ADC Channels: YES

The presence of Analog to Digital Convertor (ADC) channels allows the microcontroller to interface with analog sensors and signals, expanding its functionality.

Speed: 24 rpm

The speed of 24 rpm indicates the processing capability of the microcontroller, enabling it to handle tasks efficiently and quickly.

Technical Specifications

Microcontrollers MSP430FR2355TDBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

44

No. of Terminals:

38

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

33280

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRADA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430FR2355TDBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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