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MSP430FR2353TDBT

Texas Instruments

MSP430FR2353TDBT by Texas Instruments

MSP430FR2353TDBT by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM and 16896 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring up to 10-channel, 12-bit ADC and PWM channels. With connectivity options like I2C, SPI, UART, and IRADA, it offers versatile peripheral support in a compact package style.

Median Price

$4.170

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,030 parts In-Stock

1+ parts

$2.675

100+ parts

$2.181

1k+ parts

$1.454

10k+ parts

-

2,030

$2.675

$2.181

$1.454

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DigiKey

USA . 140 parts In-Stock

1+ parts

$4.170

100+ parts

$2.626

1k+ parts

-

10k+ parts

-

140

$4.170

$2.626

-

-

Mouser Electronics

USA . 136 parts In-Stock

1+ parts

$4.170

100+ parts

$2.620

1k+ parts

$2.470

10k+ parts

-

136

$4.170

$2.620

$2.470

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,268 parts In-Stock

1+ parts

$2.541

100+ parts

-

1k+ parts

-

10k+ parts

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4,268

$2.541

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-

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Vyrian

USA . 3,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,212

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,045 parts In-Stock

1+ parts

$2.408

100+ parts

-

1k+ parts

-

10k+ parts

-

1,045

$2.408

-

-

-

Parana Technologies

USA . 896 parts In-Stock

1+ parts

$36.382

100+ parts

-

1k+ parts

-

10k+ parts

-

896

$36.382

-

-

-

DigiPath Technology Company

USA . 1,602 parts In-Stock

1+ parts

$40.061

100+ parts

$36.857

1k+ parts

-

10k+ parts

-

1,602

$40.061

$36.857

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-

ChromeModa Solutions

Germany . 3,316 parts In-Stock

1+ parts

$40.879

100+ parts

$33.521

1k+ parts

-

10k+ parts

-

3,316

$40.879

$33.521

-

-

IDEA Electronic Components Group

UK . 2,163 parts In-Stock

1+ parts

$40.879

100+ parts

$38.835

1k+ parts

$36.791

10k+ parts

-

2,163

$40.879

$38.835

$36.791

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Overview

Unlock limitless possibilities with the Texas Instruments MSP430FR2353TDBT microcontroller. Crafted with expertise and precision, this small yet powerful device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, the MSP430FR2353TDBT delivers seamless connectivity, efficient power management, and advanced analog-to-digital conversion capabilities. Experience the perfect balance of innovation and value with Texas Instruments' cutting-edge technology. Elevate your projects and create with confidence using the MSP430FR2353TDBT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring reliable performance over time.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage options, making the microcontroller versatile for different applications.

Bit Size: 16

A 16-bit microcontroller offers higher computational power and accuracy compared to lower bit sizes, making it suitable for complex tasks.

ROM Words: 16896

With a large ROM capacity, this microcontroller can store a significant amount of program data and instructions.

ADC Channels: YES

Analog-to-Digital Converter channels allow the microcontroller to interface with analog sensors and signals, expanding its capabilities.

Maximum Clock Frequency: 24 MHz

A high clock frequency enables fast processing speeds, ideal for applications that require real-time responsiveness.

Connectivity: I2C(2), IRADA(2), SPI(4), UART(2)

Multiple communication interfaces give the microcontroller flexibility to connect with various devices and peripherals, enhancing its usability.

RAM Bytes: 2048

A generous amount of RAM allows the microcontroller to handle multitasking and data storage efficiently.

Technical Specifications

Microcontrollers MSP430FR2353TDBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

44

No. of Terminals:

38

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16896

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRADA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430FR2353TDBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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