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MSP430FR2310IRGYT

Texas Instruments

MSP430FR2310IRGYT by Texas Instruments

MSP430FR2310IRGYT by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 1024 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring PWM, RTC, and TIMER(2) peripherals. With ADC channels and analog to digital converters, it offers connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

$1.860

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,049 parts In-Stock

1+ parts

$1.322

100+ parts

$1.092

1k+ parts

$0.590

10k+ parts

-

10,049

$1.322

$1.092

$0.590

-

Mouser Electronics

USA . 357 parts In-Stock

1+ parts

$1.860

100+ parts

$1.250

1k+ parts

$1.000

10k+ parts

$0.951

357

$1.860

$1.250

$1.000

$0.951

DigiKey

USA . 65 parts In-Stock

1+ parts

$1.860

100+ parts

$1.249

1k+ parts

$1.010

10k+ parts

-

65

$1.860

$1.249

$1.010

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,283 parts In-Stock

1+ parts

$1.256

100+ parts

-

1k+ parts

-

10k+ parts

-

2,283

$1.256

-

-

-

Vyrian

USA . 8,758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,758

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,409 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

3,409

$1.190

-

-

-

Microchip USA

USA . 1,724 parts In-Stock

1+ parts

$7.747

100+ parts

-

1k+ parts

-

10k+ parts

-

1,724

$7.747

-

-

-

Parana Technologies

USA . 2,099 parts In-Stock

1+ parts

$39.225

100+ parts

-

1k+ parts

-

10k+ parts

-

2,099

$39.225

-

-

-

DigiPath Technology Company

USA . 1,059 parts In-Stock

1+ parts

$43.192

100+ parts

$39.736

1k+ parts

-

10k+ parts

-

1,059

$43.192

$39.736

-

-

IDEA Electronic Components Group

UK . 2,199 parts In-Stock

1+ parts

$44.073

100+ parts

$41.869

1k+ parts

$39.666

10k+ parts

-

2,199

$44.073

$41.869

$39.666

-

ChromeModa Solutions

Germany . 1,840 parts In-Stock

1+ parts

$44.073

100+ parts

$36.140

1k+ parts

-

10k+ parts

-

1,840

$44.073

$36.140

-

-

Overview

Upgrade your projects with the Texas Instruments MSP430FR2310IRGYT microcontroller, known for its high-quality and reliability. Manufactured by a trusted industry leader, this chip offers a wide range of applications in various industries. With features like low power consumption, advanced peripherals, and ease of connectivity, this microcontroller provides exceptional value to customers looking for efficiency and performance. Trust Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage during handling or usage.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile and compatible with various power sources.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs, optimizing space utilization on the PCB.

Bit Size: 16

16-bit architecture provides sufficient processing power for a range of applications, from simple tasks to more complex computations.

No. of Terminals: 16

Sufficient number of terminals for connecting to external components and peripherals, enhancing the microcontroller's functionality.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage enables energy-efficient operation and extends battery life in portable or low-power devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in a variety of environmental conditions.

CPU Family: MSP430

Based on the MSP430 architecture, known for its low power consumption and high performance, making it ideal for battery-operated devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and optimized processing of instructions, enhancing overall system performance.

Technical Specifications

Microcontrollers MSP430FR2310IRGYT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

12

No. of Terminals:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1024

ROM Words:

2048

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI, UART

Peripherals:

PWM, RTC, TIMER(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2310IRGYT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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