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MSP430FR2153TRHAT

Texas Instruments

MSP430FR2153TRHAT by Texas Instruments

MSP430FR2153TRHAT by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM and 16896 ROM words. It operates at a max clock frequency of 24 MHz, offering 10-Ch 12-Bit ADC channels and PWM capabilities. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$2.828

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26,750 parts In-Stock

1+ parts

$2.487

100+ parts

$2.179

1k+ parts

$1.231

10k+ parts

-

26,750

$2.487

$2.179

$1.231

-

DigiKey

USA . 656 parts In-Stock

1+ parts

$3.170

100+ parts

$1.960

1k+ parts

$1.856

10k+ parts

-

656

$3.170

$1.960

$1.856

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,823 parts In-Stock

1+ parts

$2.363

100+ parts

-

1k+ parts

-

10k+ parts

-

3,823

$2.363

-

-

-

Vyrian

USA . 8,895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,895

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,369 parts In-Stock

1+ parts

$2.238

100+ parts

-

1k+ parts

-

10k+ parts

-

1,369

$2.238

-

-

-

Microchip USA

USA . 2,520 parts In-Stock

1+ parts

$14.950

100+ parts

$14.860

1k+ parts

$14.810

10k+ parts

$14.770

2,520

$14.950

$14.860

$14.810

$14.770

Parana Technologies

USA . 315 parts In-Stock

1+ parts

$16.913

100+ parts

-

1k+ parts

$17.149

10k+ parts

-

315

$16.913

-

$17.149

-

DigiPath Technology Company

USA . 695 parts In-Stock

1+ parts

$18.623

100+ parts

-

1k+ parts

-

10k+ parts

-

695

$18.623

-

-

-

ChromeModa Solutions

Germany . 5,895 parts In-Stock

1+ parts

$19.003

100+ parts

$15.582

1k+ parts

-

10k+ parts

-

5,895

$19.003

$15.582

-

-

IDEA Electronic Components Group

UK . 2,072 parts In-Stock

1+ parts

$19.003

100+ parts

$18.053

1k+ parts

$17.103

10k+ parts

-

2,072

$19.003

$18.053

$17.103

-

Overview

Unlock the power of innovation with the MSP430FR2153TRHAT by Texas Instruments, a cutting-edge microcontroller designed to revolutionize your projects. Crafted with precision and expertise by a trusted manufacturer, this versatile device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from IoT devices to consumer electronics, this microcontroller boasts advanced features like 10-channel ADC, 2048 bytes of RAM, and FRAM programmability. Experience seamless connectivity with I2C, SPI, UART, and more, all while enjoying the reliability and efficiency that Texas Instruments is known for. Embrace the future of technology with the MSP430FR2153TRHAT and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and durable.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for compatibility with a wider range of power sources.

Bit Size: 16

A 16-bit architecture enables faster and more efficient processing of data.

No. of Terminals: 40

Having 40 terminals provides flexibility for connecting various external components and peripherals.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with existing MSP430-based systems and tools.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency allows for swift execution of instructions and operations.

ADC Channels: YES

The presence of ADC channels allows for accurate conversion of analog signals to digital data.

ROM Words: 16896

With a generous amount of ROM words, the microcontroller can store a significant amount of program data.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and streamlined operation.

RAM Bytes: 2048

Having 2048 RAM bytes allows for sufficient memory for temporary storage and data manipulation.

Technical Specifications

Microcontrollers MSP430FR2153TRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

44

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16896

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRADA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430FR2153TRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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