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MSP430FR2153TDBTR

Texas Instruments

MSP430FR2153TDBTR by Texas Instruments

MSP430FR2153TDBTR by Texas Instruments is a 16-bit microcontroller with 2048 bytes of RAM and 16896 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring up to 10-channel 12-bit ADC and PWM channels. With connectivity options like I2C, SPI, and UART, it offers versatile peripheral support in a compact package style.

Median Price

$1.826

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 350 parts In-Stock

1+ parts

$0.766

100+ parts

$0.743

1k+ parts

$0.708

10k+ parts

-

350

$0.766

$0.743

$0.708

-

Texas Instruments

USA . 13,639 parts In-Stock

1+ parts

$1.826

100+ parts

$1.508

1k+ parts

$0.815

10k+ parts

-

13,639

$1.826

$1.508

$0.815

-

Chip1Stop

Japan . 600 parts In-Stock

1+ parts

$2.040

100+ parts

$1.339

1k+ parts

$1.280

10k+ parts

-

600

$2.040

$1.339

$1.280

-

Mouser Electronics

USA . 516 parts In-Stock

1+ parts

$2.630

100+ parts

$2.240

1k+ parts

$1.310

10k+ parts

$1.280

516

$2.630

$2.240

$1.310

$1.280

Verical

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$0.743

1k+ parts

$0.708

10k+ parts

-

350

-

$0.743

$0.708

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,692 parts In-Stock

1+ parts

$1.735

100+ parts

-

1k+ parts

-

10k+ parts

-

2,692

$1.735

-

-

-

Vyrian

USA . 3,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,022

-

-

-

-

NAC Semi

USA . 135 parts In-Stock

1+ parts

-

100+ parts

$3.320

1k+ parts

$3.060

10k+ parts

-

135

-

$3.320

$3.060

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,003 parts In-Stock

1+ parts

$1.643

100+ parts

-

1k+ parts

-

10k+ parts

-

1,003

$1.643

-

-

-

Parana Technologies

USA . 1,203 parts In-Stock

1+ parts

$55.819

100+ parts

-

1k+ parts

-

10k+ parts

-

1,203

$55.819

-

-

-

ChromeModa Solutions

Germany . 5,165 parts In-Stock

1+ parts

$62.718

100+ parts

$51.429

1k+ parts

-

10k+ parts

-

5,165

$62.718

$51.429

-

-

IDEA Electronic Components Group

UK . 1,812 parts In-Stock

1+ parts

$62.718

100+ parts

$59.582

1k+ parts

$56.446

10k+ parts

-

1,812

$62.718

$59.582

$56.446

-

DigiPath Technology Company

USA . 1,727 parts In-Stock

1+ parts

-

100+ parts

$56.547

1k+ parts

-

10k+ parts

-

1,727

-

$56.547

-

-

Overview

Unlock the limitless potential of your electronic projects with the MSP430FR2153TDBTR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments brings you a high-quality solution that offers unparalleled performance and reliability. Whether you are working on IoT devices, wearable technology, or industrial automation, this microcontroller's advanced features, low power consumption, and versatile connectivity options make it the perfect choice for your next innovation. Experience the value and benefits that Texas Instruments delivers with the MSP430FR2153TDBTR and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for flexibility in power requirements.

Bit Size: 16

16-bit architecture offers enhanced processing capabilities and performance.

ROM Words: 16896

Large ROM size allows for storing a significant amount of program data.

ADC Channels: YES

Analog-to-digital converters provide the ability to interface with and process analog signals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and optimized performance for embedded applications.

RAM Bytes: 2048

Sufficient RAM capacity for data storage and processing tasks.

Analog To Digital Convertors: 10-Ch 12-Bit

Multiple ADC channels with 12-bit resolution offer high-precision analog signal conversion.

Connectivity: I2C(2), IRADA(2), SPI(4), UART(2)

Various connectivity options such as I2C, SPI, and UART enable versatile communication interfaces.

Technical Specifications

Microcontrollers MSP430FR2153TDBTR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

44

No. of Terminals:

38

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16896

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRADA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430FR2153TDBTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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