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MSP430FG6626IZCAR

Texas Instruments

MSP430FG6626IZCAR by Texas Instruments

MSP430FG6626IZCAR by Texas Instruments is a 16-bit microcontroller with 113 terminals, operating at up to 32 MHz. It features 10-Ch 16-Bit ADCs and low power mode, suitable for industrial applications requiring high-speed processing and analog-to-digital conversion. The microcontroller supports various peripherals like BOR, LCD, and UART for versatile connectivity options.

Median Price

$4.408

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,500 parts In-Stock

1+ parts

$5.180

100+ parts

$4.223

1k+ parts

$2.815

10k+ parts

-

7,500

$5.180

$4.223

$2.815

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Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.637

2,500

-

-

-

$3.637

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,856 parts In-Stock

1+ parts

$4.921

100+ parts

-

1k+ parts

-

10k+ parts

-

2,856

$4.921

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-

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Vyrian

USA . 8,418 parts In-Stock

1+ parts

-

100+ parts

-

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8,418

-

-

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Component Sense

UK . 1,569 parts In-Stock

1+ parts

-

100+ parts

-

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1,569

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,559 parts In-Stock

1+ parts

$4.662

100+ parts

-

1k+ parts

-

10k+ parts

-

3,559

$4.662

-

-

-

AZTECH Wire

Italy . 607 parts In-Stock

1+ parts

$17.300

100+ parts

-

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10k+ parts

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607

$17.300

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-

-

Microchip USA

USA . 4,763 parts In-Stock

1+ parts

$30.139

100+ parts

-

1k+ parts

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10k+ parts

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4,763

$30.139

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-

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Parana Technologies

USA . 1,894 parts In-Stock

1+ parts

$63.729

100+ parts

-

1k+ parts

-

10k+ parts

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1,894

$63.729

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-

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DigiPath Technology Company

USA . 903 parts In-Stock

1+ parts

$70.174

100+ parts

$64.560

1k+ parts

-

10k+ parts

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903

$70.174

$64.560

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ChromeModa Solutions

Germany . 3,940 parts In-Stock

1+ parts

$71.606

100+ parts

$58.717

1k+ parts

-

10k+ parts

-

3,940

$71.606

$58.717

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IDEA Electronic Components Group

UK . 818 parts In-Stock

1+ parts

$71.606

100+ parts

$68.026

1k+ parts

$64.445

10k+ parts

-

818

$71.606

$68.026

$64.445

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FG6626IZCAR microcontroller. Built with precision and reliability, this product offers unmatched performance for a wide range of applications. From industrial automation to consumer electronics, the possibilities are endless with the cutting-edge technology of the MSP430 family. Experience seamless connectivity, low power consumption, and advanced features that bring your designs to life. Trust in Texas Instruments for superior quality and value, revolutionizing the way you approach microcontroller solutions. Elevate your projects with the MSP430FG6626IZCAR - where excellence meets opportunity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount packaging allows for easier and more efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 3.6 V

Operates at a maximum supply voltage of 3.6V, suitable for a wide range of battery-operated devices.

On Chip Data RAM Width: 16

Wide data RAM width of 16 bits allows for faster data processing and storage capabilities.

ADC Channels: YES

Integrated analog-to-digital converters provide the ability to interface with various sensors and inputs, expanding the device's functionality.

ROM Words: 131072

Large ROM capacity of 131072 words allows for storing complex programs and data, enabling versatile applications.

Maximum Clock Frequency: 32 MHz

High clock frequency of 32MHz provides fast execution speeds, enhancing overall performance of the microcontroller.

Connectivity: I2C(2), IRDA(2), SPI(2), UART(2), USB

Multiple connectivity options such as I2C, IRDA, SPI, UART, and USB offer versatile communication interfaces for connecting with other devices.

Low Power Mode: YES

Supports low power modes for energy-efficient operation, prolonging battery life in portable devices.

Technical Specifications

Microcontrollers MSP430FG6626IZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

73

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Digital To Analog Convertors:

2 Ch 12-Bit

Trade Compliance

MSP430FG6626IZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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