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MSP430FG6625IPZR

Texas Instruments

MSP430FG6625IPZR by Texas Instruments

MSP430FG6625IPZR by Texas Instruments is a 16-bit microcontroller with 73 I/O lines, 15-Ch 16-Bit ADCs, and 2-Ch 12-Bit DACs. Ideal for industrial applications due to its low power mode, operating temperature range of -40 to 85 °C, and connectivity options like I2C, SPI, UART.

Median Price

$4.767

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,655 parts In-Stock

1+ parts

$4.767

100+ parts

$3.887

1k+ parts

$2.591

10k+ parts

-

3,655

$4.767

$3.887

$2.591

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 636 parts In-Stock

1+ parts

$4.529

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-

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636

$4.529

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Vyrian

USA . 5,022 parts In-Stock

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5,022

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Distributors (Availability)

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Corphita

USA . 872 parts In-Stock

1+ parts

$4.290

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-

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872

$4.290

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AZTECH Wire

Italy . 793 parts In-Stock

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$19.990

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793

$19.990

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Microchip USA

USA . 1,511 parts In-Stock

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$22.960

100+ parts

$22.820

1k+ parts

$22.750

10k+ parts

$22.680

1,511

$22.960

$22.820

$22.750

$22.680

Parana Technologies

USA . 1,677 parts In-Stock

1+ parts

$65.451

100+ parts

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1,677

$65.451

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DigiPath Technology Company

USA . 1,571 parts In-Stock

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$72.069

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1,571

$72.069

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ChromeModa Solutions

Germany . 2,801 parts In-Stock

1+ parts

$73.540

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$60.303

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2,801

$73.540

$60.303

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IDEA Electronic Components Group

UK . 484 parts In-Stock

1+ parts

$73.540

100+ parts

$69.863

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$66.186

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484

$73.540

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$66.186

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Emar International I/E

Canada . 996 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430FG6625IPZR microcontroller by Texas Instruments. Designed with precision and reliability in mind, this product offers a wide range of applications in various industries. From low power modes to high-speed connectivity options, this microcontroller provides unmatched performance and efficiency. Experience seamless operation and enhanced functionality with the MSP430FG6625IPZR, setting new standards in the world of microcontrollers. Elevate your projects with Texas Instruments' cutting-edge technology and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a variety of systems.

RAM Bytes: 8192

Provides ample memory for data storage and processing, allowing for efficient operation of the microcontroller.

ADC Channels: YES

Allows for analog signals to be converted to digital data for processing, expanding the range of applications the microcontroller can be used in.

Maximum Clock Frequency: 32 MHz

Enables fast processing speeds and high performance, making it suitable for applications that require real-time data processing.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Offers a variety of communication options, making it versatile and compatible with different systems and protocols.

Technical Specifications

Microcontrollers MSP430FG6625IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

HAVING ADDITIONAL 2KB OF USB SRAM, WILL WORK WHEN USB NOT IN USE;

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

73

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

COMPARATOR(12), DMA(6), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

15-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430FG6625IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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