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MSP430FG6426IPZR

Texas Instruments

MSP430FG6426IPZR by Texas Instruments

MSP430FG6426IPZR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 10240 RAM bytes. It features 15-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$4.541

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,626 parts In-Stock

1+ parts

$4.541

100+ parts

$3.702

1k+ parts

$2.468

10k+ parts

-

8,626

$4.541

$3.702

$2.468

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.510

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$3.510

-

-

-

Digiode

USA . 4,718 parts In-Stock

1+ parts

$4.314

100+ parts

-

1k+ parts

-

10k+ parts

-

4,718

$4.314

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-

-

Vyrian

USA . 7,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,987

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$3.510

100+ parts

$3.334

1k+ parts

$3.168

10k+ parts

$3.124

100

$3.510

$3.334

$3.168

$3.124

Ampacity Inc.

Singapore . 8,370 parts In-Stock

1+ parts

$3.860

100+ parts

-

1k+ parts

-

10k+ parts

-

8,370

$3.860

-

-

-

Corphita

USA . 1,888 parts In-Stock

1+ parts

$4.087

100+ parts

-

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-

10k+ parts

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1,888

$4.087

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-

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AZTECH Wire

Italy . 682 parts In-Stock

1+ parts

$12.460

100+ parts

-

1k+ parts

-

10k+ parts

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682

$12.460

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-

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Parana Technologies

USA . 1,780 parts In-Stock

1+ parts

$47.824

100+ parts

-

1k+ parts

-

10k+ parts

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1,780

$47.824

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DigiPath Technology Company

USA . 168 parts In-Stock

1+ parts

$52.660

100+ parts

-

1k+ parts

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168

$52.660

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-

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IDEA Electronic Components Group

UK . 2,157 parts In-Stock

1+ parts

$53.735

100+ parts

$51.048

1k+ parts

$48.362

10k+ parts

-

2,157

$53.735

$51.048

$48.362

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ChromeModa Solutions

Germany . 2,150 parts In-Stock

1+ parts

$53.735

100+ parts

$44.063

1k+ parts

-

10k+ parts

-

2,150

$53.735

$44.063

-

-

Overview

Unleash the power of innovation with the MSP430FG6426IPZR by Texas Instruments, a top-tier microcontroller that sets the standard for quality and performance. Designed for a wide range of applications, this cutting-edge device boasts unparalleled value and benefits for customers seeking efficient solutions. With advanced features such as DAC and ADC channels, DMA capabilities, and low power mode, this microcontroller offers unmatched versatility and reliability. Elevate your projects to new heights with the trusted expertise of Texas Instruments embedded in every aspect of this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Enhances durability and reduces the weight of the product

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options

Bit Size: 16

High bit size allows for complex operations and calculations to be performed

ADC Channels: YES

Enables analog-to-digital conversion for sensing applications

ROM Words: 131072

Large memory capacity for storing program instructions and data

Maximum Clock Frequency: 32 MHz

High clock frequency enables fast processing speeds

Analog To Digital Convertors: 15-Ch 16-Bit

Supports multiple analog inputs with high resolution for accurate conversions

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2)

Versatile connectivity options for interfacing with other devices

Low Power Mode: YES

Allows for efficient power management, extending battery life

Technical Specifications

Microcontrollers MSP430FG6426IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 8MHZ AT 1.8V MIN SUPPLY

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

73

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

10240

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

COMPARATOR(12), DMA(6), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

15-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430FG6426IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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