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MSP430FG478IZCAR

Texas Instruments

MSP430FG478IZCAR by Texas Instruments

MSP430FG478IZCAR by Texas Instruments is a 16-bit microcontroller with 1024 RAM words and 49152 ROM words. It features 2-CH 12-BIT DAC, 1-Ch 16-Bit ADC, and peripherals like BOD, LCD, RTC. Ideal for industrial applications requiring low power consumption and high-speed operation up to 8 MHz.

Median Price

$10.680

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,198 parts In-Stock

1+ parts

$10.680

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21,198

$10.680

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,904 parts In-Stock

1+ parts

$10.146

100+ parts

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3,904

$10.146

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Vyrian

USA . 8,206 parts In-Stock

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8,206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 345 parts In-Stock

1+ parts

$9.612

100+ parts

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345

$9.612

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AZTECH Wire

Italy . 36 parts In-Stock

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$16.500

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36

$16.500

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Parana Technologies

USA . 785 parts In-Stock

1+ parts

$48.791

100+ parts

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785

$48.791

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DigiPath Technology Company

USA . 1,244 parts In-Stock

1+ parts

$53.725

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1,244

$53.725

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ChromeModa Solutions

Germany . 5,175 parts In-Stock

1+ parts

$54.821

100+ parts

$44.953

1k+ parts

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5,175

$54.821

$44.953

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IDEA Electronic Components Group

UK . 1,719 parts In-Stock

1+ parts

$54.821

100+ parts

$52.080

1k+ parts

$49.339

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1,719

$54.821

$52.080

$49.339

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Component Stockers USA

USA . 15,981 parts In-Stock

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15,981

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QUARKTWIN TECHNOLOGY LTD

USA . 13,695 parts In-Stock

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13,695

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FG478IZCAR microcontroller. Crafted with precision and expertise, this device offers unparalleled reliability and performance in a variety of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers exceptional value and efficiency, making it the ideal choice for your next project. Experience the seamless integration of advanced features and cutting-edge technology, all packed into a compact and robust package. Trust in Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding significant weight.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring stable performance.

On Chip Data RAM Width: 16

Wide data RAM width enables efficient data processing for complex applications.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space and easy integration into different designs.

Bit Size: 16

The 16-bit architecture provides higher data processing capability compared to lower bit sizes.

DAC Channels: YES

Presence of Digital to Analog Converters allows for analog signal generation and control in various applications.

No. of Terminals: 113

Sufficient terminals for connecting to various external components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact package style with fine pitch design enables high-density mounting on PCBs.

Minimum Supply Voltage: 1.8 V

Wide range of supply voltage options for flexibility in powering the microcontroller.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high temperature requirements.

CPU Family: MSP430

Part of a well-established CPU family known for performance and reliability.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold temperatures, suitable for a variety of environments.

Terminal Finish: TIN SILVER COPPER

Quality terminal finish for reliable connections and enhanced durability.

ADC Channels: YES

Analog to Digital Converters facilitate input from analog sensors and devices for precise measurements.

Terminal Position: BOTTOM

Bottom terminal position allows for secure and stable PCB mounting.

ROM Words: 49152

Large ROM capacity for storing program code and data.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

Digital To Analog Convertors: 2-CH 12-BIT

Multiple DAC channels with 12-bit resolution for precise analog signal generation.

RAM Words: 1024

Sufficient RAM capacity for data storage and efficient program execution.

Width: 7 mm

Compact width for easy integration into various electronic devices.

Boundary Scan: YES

Boundary scan support for enhanced testing and debugging capabilities.

Peripherals: BOD, COMPARATOR, LCD, RTC, TIMER(7), RTC, WDT

Rich set of peripherals for added functionality and application versatility.

Maximum Clock Frequency: 8 MHz

High clock frequency ensures fast processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Suitable reflow temperature profile for efficient soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable soldering and PCB assembly.

Length: 7 mm

Compact length for space-efficient PCB design and integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for robust performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient data processing and execution speed.

No. of Timers: 7

Multiple timers for precise timing control and event scheduling.

RAM Bytes: 2048

Expanded RAM capacity for data storage and efficient program execution.

Technology: CMOS

CMOS technology for low power consumption and reliable operation.

Terminal Form: BALL

Ball terminal form for secure and reliable connections on the PCB.

Analog To Digital Convertors: 1-Ch 16-Bit

High-resolution ADC for accurate analog signal conversion.

Maximum Supply Current: 0.46 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources.

No. of Serial I/Os: 2

Multiple serial I/O interfaces for communication with external devices.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog signals.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Diverse connectivity options for seamless integration with different communication protocols.

ROM Programmability: FLASH

Flash ROM programmability for easy code updates and field upgrades.

Terminal Pitch: 0.5 mm

Fine pitch terminal design for high-density PCB mounting and space efficiency.

Format: FIXED POINT

Fixed-point arithmetic format for efficient numerical calculations in embedded systems.

Moisture Sensitivity Level (MSL): 3

Moisture-resistant design for reliable operation in varying environmental conditions.

Speed: 8 rpm

High processing speed for responsive control and real-time applications.

Low Power Mode: YES

Low power mode for energy-saving operation and extended battery life.

On Chip Program ROM Width: 8

Efficient program ROM width for storing code and data on the chip.

No. of I/O Lines: 48

Sufficient I/O lines for connecting to external sensors, actuators, and peripherals.

Technical Specifications

Microcontrollers MSP430FG478IZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

7

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Maximum Supply Current:

.46 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Peripherals:

BOD, COMPARATOR, LCD, RTC, TIMER(7), RTC, WDT

Analog To Digital Convertors:

1-Ch 16-Bit

Digital To Analog Convertors:

2-CH 12-BIT

Trade Compliance

MSP430FG478IZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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