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MSP430FG4618IZQWT

Texas Instruments

MSP430FG4618IZQWT by Texas Instruments

MSP430FG4618IZQWT by Texas Instruments is a 16-bit microcontroller with 80 I/O lines, 2 DAC channels, and 12 ADC channels. It operates at a max clock frequency of 8 MHz and has low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing and multiple analog-to-digital conversions.

Median Price

$10.910

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 38 parts In-Stock

1+ parts

$10.910

100+ parts

$10.690

1k+ parts

$10.470

10k+ parts

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38

$10.910

$10.690

$10.470

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Distributors (In-Stock)

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Vyrian

USA . 4,921 parts In-Stock

1+ parts

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4,921

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Digiode

USA . 3,568 parts In-Stock

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3,568

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Cyclops Electronics Ltd

UK . 1,351 parts In-Stock

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1,351

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Distributors (Availability)

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Ampacity Inc.

Singapore . 310 parts In-Stock

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$5.000

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-

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310

$5.000

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AZTECH Wire

Italy . 284 parts In-Stock

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$10.956

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284

$10.956

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One Stop Electronics

USA . 815 parts In-Stock

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$22.000

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815

$22.000

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Parana Technologies

USA . 1,147 parts In-Stock

1+ parts

$53.005

100+ parts

$4,922.303

1k+ parts

$47.704

10k+ parts

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1,147

$53.005

$4,922.303

$47.704

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DigiPath Technology Company

USA . 171 parts In-Stock

1+ parts

$58.365

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171

$58.365

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ChromeModa Solutions

Germany . 6,972 parts In-Stock

1+ parts

$59.556

100+ parts

$48.836

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6,972

$59.556

$48.836

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

1+ parts

$59.556

100+ parts

$56.578

1k+ parts

$53.600

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1,078

$59.556

$56.578

$53.600

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Corphita

USA . 4,983 parts In-Stock

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4,983

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Microchip USA

USA . 233 parts In-Stock

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Overview

Unlock endless possibilities with the MSP430FG4618IZQWT by Texas Instruments, a top-of-the-line microcontroller designed to meet your every need. Boasting the renowned quality of its manufacturer, this device offers unparalleled value and benefits in a wide range of applications. From industrial automation to consumer electronics, the MSP430FG4618IZQWT delivers high performance and reliability, making it the ultimate choice for customers seeking top-notch solutions. Experience the power of innovation with Texas Instruments and take your projects to new heights with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and cost-effectiveness.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for better performance and functionality in various applications.

Bit Size: 16

A larger bit size allows for more complex operations and calculations to be performed by the microcontroller.

ADC Channels: YES

Having Analog to Digital Converter channels allows for easy integration with sensors and other analog devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in microcontrollers enables fast and efficient processing of instructions, making it a good choice for embedded systems.

Maximum Clock Frequency: 8 MHz

Higher clock frequency allows for faster processing speeds, making it suitable for applications requiring quick response times.

Connectivity: I2C, IRDA, SCI(2), SPI(3), UART(2)

Multiple connectivity options provide flexibility in communication with external devices, expanding the range of applications this microcontroller can be used for.

Low Power Mode: YES

Low power mode helps in conserving energy, making it suitable for battery-powered devices or applications where power consumption is a concern.

Technical Specifications

Microcontrollers MSP430FG4618IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 3MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

80

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

11

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

RAM Words:

8

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.74 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(3), UART(2)"

Peripherals:

"BOR, COMPARATOR, DMA(3), LCD, RTC, TIMER(11), WDT"

Analog To Digital Convertors:

12-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430FG4618IZQWT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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