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MSP430FG4618IZCAT

Texas Instruments

MSP430FG4618IZCAT by Texas Instruments

MSP430FG4618IZCAT by Texas Instruments is a 16-bit microcontroller with 113 terminals, 4096 RAM words, and 118784 ROM words. It features 2 DAC channels, 12 ADC channels, and operates at a max clock frequency of 8 MHz. Ideal for industrial applications requiring low power consumption and multiple peripherals like timers, UARTs, and SPI connectivity.

Median Price

$23.680

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,495 parts In-Stock

1+ parts

$19.321

100+ parts

$16.877

1k+ parts

$11.639

10k+ parts

-

2,495

$19.321

$16.877

$11.639

-

DigiKey

USA . 97 parts In-Stock

1+ parts

$28.040

100+ parts

$20.009

1k+ parts

-

10k+ parts

-

97

$28.040

$20.009

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,417 parts In-Stock

1+ parts

$18.355

100+ parts

-

1k+ parts

-

10k+ parts

-

4,417

$18.355

-

-

-

Vyrian

USA . 3,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,588

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,555 parts In-Stock

1+ parts

$17.389

100+ parts

-

1k+ parts

-

10k+ parts

-

2,555

$17.389

-

-

-

Microchip USA

USA . 2,782 parts In-Stock

1+ parts

$40.740

100+ parts

$40.150

1k+ parts

$39.860

10k+ parts

$39.570

2,782

$40.740

$40.150

$39.860

$39.570

Parana Technologies

USA . 1,135 parts In-Stock

1+ parts

$65.467

100+ parts

$6,079.569

1k+ parts

$58.920

10k+ parts

-

1,135

$65.467

$6,079.569

$58.920

-

DigiPath Technology Company

USA . 825 parts In-Stock

1+ parts

$72.087

100+ parts

$66.320

1k+ parts

-

10k+ parts

-

825

$72.087

$66.320

-

-

ChromeModa Solutions

Germany . 3,530 parts In-Stock

1+ parts

$73.558

100+ parts

$60.318

1k+ parts

-

10k+ parts

-

3,530

$73.558

$60.318

-

-

IDEA Electronic Components Group

UK . 1,651 parts In-Stock

1+ parts

$73.558

100+ parts

$69.880

1k+ parts

$66.202

10k+ parts

-

1,651

$73.558

$69.880

$66.202

-

Overview

Unlock endless possibilities with the MSP430FG4618IZCAT microcontroller by Texas Instruments. Designed with precision and reliability in mind, this versatile device offers a wide range of applications in various industries. From its advanced technology to its low power consumption, the MSP430FG4618IZCAT delivers exceptional performance and efficiency. Experience seamless connectivity and high-speed processing with this innovative solution. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations. Elevate your projects with the MSP430FG4618IZCAT and unleash the power of next-generation technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the microcontroller, making it durable and resistant to external elements.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating various voltage requirements.

DAC Channels: YES

Allows for digital-to-analog conversion, enabling the microcontroller to interface with analog devices.

ADC Channels: YES

Enables analog-to-digital conversion, making it suitable for applications that require sensing and measuring analog signals.

DMA Channels: YES

Supports Direct Memory Access, improving data transfer efficiency and freeing up the CPU for other tasks.

Maximum Clock Frequency: 8 MHz

Provides the necessary processing speed for a wide range of applications while maintaining efficiency.

ROM Programmability: FLASH

Offers flexibility in programming and updating the microcontroller's software, enhancing its usability and adaptability.

Low Power Mode: YES

Helps to conserve energy and prolong battery life, making the microcontroller suitable for power-sensitive applications.

Technical Specifications

Microcontrollers MSP430FG4618IZCAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

80

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

11

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

118784

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Maximum Supply Current:

.74 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(3), UART(2), USCI(2), USART

Peripherals:

BOD, COMPARATOR(2), DMA(3), LCD, POR, TIMER(11), RTC, WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Digital To Analog Convertors:

2-CH 12-BIT

Trade Compliance

MSP430FG4618IZCAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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