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MSP430FG4260IRGZT

Texas Instruments

MSP430FG4260IRGZT by Texas Instruments

MSP430FG4260IRGZT by Texas Instruments is a 16-bit microcontroller with 256 bytes of RAM and 24576 ROM words. It operates at a max clock frequency of 8 MHz, suitable for industrial applications requiring low power consumption and high performance. With DAC and ADC channels, it offers precise analog signal processing capabilities in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,318 parts In-Stock

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Digiode

USA . 2,258 parts In-Stock

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One Stop Electronics

USA . 567 parts In-Stock

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$3.000

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567

$3.000

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AZTECH Wire

Italy . 870 parts In-Stock

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$10.131

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Parana Technologies

USA . 1,665 parts In-Stock

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$24.984

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$25.683

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DigiPath Technology Company

USA . 2,196 parts In-Stock

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$27.511

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ChromeModa Solutions

Germany . 4,479 parts In-Stock

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$28.072

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$23.019

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IDEA Electronic Components Group

UK . 1,998 parts In-Stock

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$28.072

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$26.668

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$25.265

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$28.072

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Corphita

USA . 2,354 parts In-Stock

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Microchip USA

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Kepictronics

USA . 241 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430FG4260IRGZT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that cater to a wide range of applications. From smart home devices to industrial automation, this product offers unparalleled value and benefits to customers looking for reliable performance and efficiency. Experience the advantages of cutting-edge technology and seamless integration with the MSP430FG4260IRGZT, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, making the product suitable for various environments.

Surface Mount: YES

Enables easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, providing flexibility in power sourcing for different applications.

Bit Size: 16

Offers a good balance between processing power and energy efficiency, suitable for a wide range of tasks.

DAC Channels: YES

Enables the conversion of digital signals to analog, allowing for precise control and communication with external devices.

Power Supplies (V): 2/3.3

Supports multiple power supply options, increasing compatibility with various systems and devices.

No. of Terminals: 48

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers a compact and efficient design that minimizes space requirements and enhances heat dissipation.

Minimum Supply Voltage: 1.8 V

Ensures operation at lower power levels, contributing to energy efficiency and extended battery life.

Maximum Operating Temperature: 85 °C

Allows the product to function reliably in high-temperature environments, suitable for industrial applications.

CPU Family: MSP430

Belongs to a reputable and well-established processor family known for its performance and reliability.

Minimum Operating Temperature: -40 °C

Ensures operation in cold environments without performance degradation, suitable for diverse operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission over time.

ADC Channels: YES

Enables the conversion of analog signals to digital, facilitating accurate sensor readings and data acquisition.

Terminal Position: QUAD

Facilitates easy and secure mounting on circuit boards, enhancing stability and signal integrity.

ROM Words: 24576

Offers sufficient memory capacity for storing program instructions and data, supporting complex applications.

Maximum Seated Height: 1 mm

Features a low-profile design that allows for compact and slim product dimensions, ideal for space-constrained applications.

Width: 7 mm

Compact width dimensions enable flexible mounting and integration into various electronic systems and devices.

Maximum Clock Frequency: 8 MHz

Provides a balance between processing speed and power consumption, suitable for a wide range of real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Indicates the reflow process duration, ensuring proper soldering and assembly of the product onto circuit boards.

Peak Reflow Temperature °C: 260

Specifies the maximum temperature for solder reflow process, ensuring component integrity and reliability.

Length: 7 mm

Optimal length dimensions for compact and space-efficient product design and integration.

Temperature Grade: INDUSTRIAL

Certified for industrial operating conditions, providing ruggedness and reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Employs a reduced instruction set computing architecture for efficient and optimized processing of tasks.

RAM Bytes: 256

Sufficient random access memory capacity for buffering and storing temporary data during program execution.

Technology: CMOS

Utilizes complementary metal-oxide-semiconductor technology for low-power operation and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form that complies with environmental regulations and RoHS standards.

Nominal Supply Voltage: 3 V

Standard supply voltage level for compatibility with common power sources and systems.

PWM Channels: YES

Supports pulse-width modulation for precise control of analog signals, enabling efficient motor control and power management.

ROM Programmability: FLASH

Utilizes flash memory technology for fast and versatile programming of read-only memory, enabling flexible firmware updates.

Terminal Pitch: 0.5 mm

Compact terminal pitch for fine-pitch mounting and compact circuit board design, saving space and simplifying assembly.

Moisture Sensitivity Level (MSL): 3

Indicates the moisture sensitivity level for proper handling and storage of the component during assembly and usage.

Speed: 8 rpm

Specifies the maximum rotational speed for motor control applications, ensuring precise and efficient operation.

No. of I/O Lines: 32

Offers ample input/output lines for interfacing with external devices, sensors, and peripherals, enhancing connectivity and functionality.

Technical Specifications

Microcontrollers MSP430FG4260IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430FG4260IRGZT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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