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MSP430FG4260IDLR

Texas Instruments

MSP430FG4260IDLR by Texas Instruments

MSP430FG4260IDLR by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 8 MHz. It features 256 bytes of RAM, 32 I/O lines, and peripherals like BOR, LCD, TIMER(4), WDT. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$4.299

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,490 parts In-Stock

1+ parts

$4.928

100+ parts

$4.017

1k+ parts

$2.678

10k+ parts

-

4,490

$4.928

$4.017

$2.678

-

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.350

1k+ parts

$3.000

10k+ parts

$2.820

1,000

-

$3.350

$3.000

$2.820

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.410

1k+ parts

-

10k+ parts

-

1,000

-

$4.410

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.188

1k+ parts

$3.750

10k+ parts

$3.525

1,000

-

$4.188

$3.750

$3.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,745 parts In-Stock

1+ parts

$3.534

100+ parts

-

1k+ parts

-

10k+ parts

-

3,745

$3.534

-

-

-

Vyrian

USA . 3,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,534

-

-

-

-

DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 909 parts In-Stock

1+ parts

$3.348

100+ parts

-

1k+ parts

-

10k+ parts

-

909

$3.348

-

-

-

Microchip USA

USA . 2,232 parts In-Stock

1+ parts

$23.730

100+ parts

$23.590

1k+ parts

$23.520

10k+ parts

$23.440

2,232

$23.730

$23.590

$23.520

$23.440

Parana Technologies

USA . 2,019 parts In-Stock

1+ parts

$59.117

100+ parts

-

1k+ parts

-

10k+ parts

-

2,019

$59.117

-

-

-

DigiPath Technology Company

USA . 167 parts In-Stock

1+ parts

$65.096

100+ parts

$59.888

1k+ parts

-

10k+ parts

-

167

$65.096

$59.888

-

-

ChromeModa Solutions

Germany . 4,454 parts In-Stock

1+ parts

$66.424

100+ parts

$54.468

1k+ parts

-

10k+ parts

-

4,454

$66.424

$54.468

-

-

IDEA Electronic Components Group

UK . 1,540 parts In-Stock

1+ parts

$66.424

100+ parts

$63.103

1k+ parts

$59.782

10k+ parts

-

1,540

$66.424

$63.103

$59.782

-

Perfect Parts

USA . 433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

433

-

-

-

-

Overview

Enhance your projects with the Texas Instruments MSP430FG4260IDLR Microcontroller, a high-quality product designed to meet your needs. With Texas Instruments' reputation for excellence in manufacturing, this microcontroller offers unmatched reliability and performance. Perfect for a wide range of applications, this versatile product provides value and benefits that will elevate your designs. Experience seamless operation, efficient power management, and advanced features that set this microcontroller apart from the rest. Unlock new possibilities and unleash your creativity with the MSP430FG4260IDLR by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Highly durable and cost-effective material for packaging, ensuring protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a wide range of applications.

Bit Size: 16

Provides a good balance between processing power and efficiency for various tasks.

ADC Channels: YES

Enables analog sensing and conversion capabilities, essential for many embedded systems.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with a wide operating temperature range.

Analog To Digital Convertors: 8-Ch 16-Bit

Multiple high-resolution ADC channels allow for precise analog data acquisition.

PWM Channels: YES

Supports Pulse Width Modulation for controlling motor speeds, LED brightness, and more.

Low Power Mode: YES

Efficient power management feature for extending battery life in portable devices.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming and updating of the microcontroller's firmware.

Technical Specifications

Microcontrollers MSP430FG4260IDLR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

0

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

2.79 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.52 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.49 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOR, LCD, TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MSP430FG4260IDLR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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