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MSP430FE4272IPMR

Texas Instruments

MSP430FE4272IPMR by Texas Instruments

MSP430FE4272IPMR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It operates at a max clock frequency of 8.4 MHz, suitable for industrial applications requiring low power consumption and connectivity via USART for PWM control.

Median Price

$3.336

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 985 parts In-Stock

1+ parts

$2.142

100+ parts

$2.041

1k+ parts

$1.974

10k+ parts

-

985

$2.142

$2.041

$1.974

-

Chip1Stop

Japan . 995 parts In-Stock

1+ parts

$4.530

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-

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-

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995

$4.530

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Texas Instruments

USA . 31,480 parts In-Stock

1+ parts

$5.365

100+ parts

$4.374

1k+ parts

$2.916

10k+ parts

-

31,480

$5.365

$4.374

$2.916

-

Verical

USA . 985 parts In-Stock

1+ parts

-

100+ parts

$2.041

1k+ parts

$1.974

10k+ parts

-

985

-

$2.041

$1.974

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,756 parts In-Stock

1+ parts

$4.304

100+ parts

-

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4,756

$4.304

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-

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Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$5.240

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-

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64

$5.240

-

-

-

Chip Stock

USA . 48,440 parts In-Stock

1+ parts

-

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48,440

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Vyrian

USA . 4,400 parts In-Stock

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-

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4,400

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,153 parts In-Stock

1+ parts

$2.950

100+ parts

-

1k+ parts

-

10k+ parts

-

9,153

$2.950

-

-

-

Corphita

USA . 4,094 parts In-Stock

1+ parts

$4.077

100+ parts

-

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-

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4,094

$4.077

-

-

-

Component Stockers USA

USA . 2,575 parts In-Stock

1+ parts

$4.600

100+ parts

$3.910

1k+ parts

-

10k+ parts

-

2,575

$4.600

$3.910

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$5.135

100+ parts

-

1k+ parts

$4.930

10k+ parts

-

100

$5.135

-

$4.930

-

Continental Prestige Electronics

USA . 6,220 parts In-Stock

1+ parts

$5.240

100+ parts

-

1k+ parts

-

10k+ parts

$5.135

6,220

$5.240

-

-

$5.135

AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$13.440

100+ parts

-

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233

$13.440

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-

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Parana Technologies

USA . 1,404 parts In-Stock

1+ parts

$17.446

100+ parts

-

1k+ parts

$17.646

10k+ parts

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1,404

$17.446

-

$17.646

-

IDEA Electronic Components Group

UK . 1,968 parts In-Stock

1+ parts

$19.602

100+ parts

$18.622

1k+ parts

$17.642

10k+ parts

-

1,968

$19.602

$18.622

$17.642

-

ChromeModa Solutions

Germany . 1,433 parts In-Stock

1+ parts

$19.602

100+ parts

$16.074

1k+ parts

-

10k+ parts

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1,433

$19.602

$16.074

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-

Microchip USA

USA . 2,892 parts In-Stock

1+ parts

$25.840

100+ parts

$25.680

1k+ parts

$25.610

10k+ parts

$25.530

2,892

$25.840

$25.680

$25.610

$25.530

Corohmni

South Africa . 122 parts In-Stock

1+ parts

$55.677

100+ parts

-

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122

$55.677

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Perfect Parts

USA . 264,683 parts In-Stock

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264,683

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Futuretech Components

Singapore . 15,000 parts In-Stock

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15,000

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A-Z Elektronik GmbH

Germany . 8,000 parts In-Stock

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8,000

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 4,401 parts In-Stock

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4,401

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 1,558 parts In-Stock

1+ parts

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100+ parts

$17.673

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1,558

-

$17.673

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S.R.D Solutions

India . 1,000 parts In-Stock

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1,000

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iodParts Technologies Inc.

India . 110 parts In-Stock

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110

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Overview

Unlock unparalleled performance and efficiency with the MSP430FE4272IPMR by Texas Instruments. As a leading manufacturer in the microcontroller industry, Texas Instruments delivers top-notch quality and reliability. Ideal for a wide range of applications, this microcontroller offers benefits such as low power consumption, high-speed processing, and advanced connectivity options. Experience seamless integration and enhanced functionality with the MSP430FE4272IPMR, setting new standards for innovation and performance in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage capabilities.

Bit Size: 16

A 16-bit microcontroller offers better performance and processing capabilities compared to lower bit sizes.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages provides compatibility with various power sources and reduces the need for additional components.

ADC Channels: YES

Analog to Digital Convertors enable the microcontroller to interface with analog sensors or devices, expanding its functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller allows for efficient and fast processing of instructions, leading to improved overall performance.

Maximum Clock Frequency: 8.4 MHz

Higher clock frequency enables fast data processing and execution of instructions, making the microcontroller suitable for applications requiring high speed.

Connectivity: USART

USART connectivity allows for serial communication, enabling the microcontroller to interact with other devices or systems easily.

RAM Bytes: 1024

Having a larger RAM size provides more memory space for data storage and manipulation, enhancing the microcontroller's capability to handle complex tasks.

Technical Specifications

Microcontrollers MSP430FE4272IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8.4 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USART

Peripherals:

BOR, LCD, TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 16-Bit

Trade Compliance

MSP430FE4272IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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