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MSP430FE423AIPM

Texas Instruments

MSP430FE423AIPM by Texas Instruments

MSP430FE423AIPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 8 MHz. It features 6-Ch 16-Bit ADC channels and peripherals like BOR, LCD, TIMER(4), WDT. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$5.208

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,510 parts In-Stock

1+ parts

$5.208

100+ parts

$4.563

1k+ parts

$2.578

10k+ parts

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1,510

$5.208

$4.563

$2.578

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 247 parts In-Stock

1+ parts

$4.948

100+ parts

-

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-

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247

$4.948

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Vyrian

USA . 7,712 parts In-Stock

1+ parts

-

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7,712

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Distributors (Availability)

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Corphita

USA . 4,503 parts In-Stock

1+ parts

$4.687

100+ parts

-

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4,503

$4.687

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AZTECH Wire

Italy . 355 parts In-Stock

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$19.800

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355

$19.800

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Microchip USA

USA . 2,566 parts In-Stock

1+ parts

$30.130

100+ parts

$29.940

1k+ parts

$29.850

10k+ parts

$29.760

2,566

$30.130

$29.940

$29.850

$29.760

Parana Technologies

USA . 2,299 parts In-Stock

1+ parts

$34.868

100+ parts

-

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2,299

$34.868

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DigiPath Technology Company

USA . 1,975 parts In-Stock

1+ parts

$38.394

100+ parts

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1,975

$38.394

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ChromeModa Solutions

Germany . 4,414 parts In-Stock

1+ parts

$39.178

100+ parts

$32.126

1k+ parts

-

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4,414

$39.178

$32.126

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IDEA Electronic Components Group

UK . 429 parts In-Stock

1+ parts

$39.178

100+ parts

$37.219

1k+ parts

$35.260

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429

$39.178

$37.219

$35.260

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QUARKTWIN TECHNOLOGY LTD

USA . 25,531 parts In-Stock

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25,531

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Perfect Parts

USA . 356 parts In-Stock

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356

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FE423AIPM microcontroller. Designed for high performance and reliability, this versatile device offers a wide range of applications in various industries. With advanced features like low power consumption, integrated peripherals, and high-speed connectivity options, the MSP430FE423AIPM delivers exceptional value to customers seeking cutting-edge solutions. Trust in Texas Instruments' reputation for quality and experience the benefits of superior technology with this state-of-the-art microcontroller. Elevate your projects to new heights with the MSP430FE423AIPM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltage, providing flexibility in system design.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it suitable for battery-operated devices.

ADC Channels: YES

Integrated ADC channels enable the device to convert analog signals to digital data, enhancing its versatility in sensor applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and convenient firmware updates without the need for external programming tools.

Connectivity: SPI, USART

Supports multiple communication interfaces such as SPI and USART, enabling seamless integration with other devices.

Low Power Mode: YES

With a low power mode, the device can conserve energy and extend battery life, ideal for energy-efficient applications.

Technical Specifications

Microcontrollers MSP430FE423AIPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, USART

Peripherals:

BOR, LCD, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 16-Bit

Trade Compliance

MSP430FE423AIPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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