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MSP430F6735IPNR

Texas Instruments

MSP430F6735IPNR by Texas Instruments

MSP430F6735IPNR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 4096 RAM bytes, and 52 I/O lines. It operates at -40 to 85°C, suitable for industrial applications requiring low power consumption and high performance. With ADC and PWM channels, it's ideal for embedded systems design in various industries.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,221 parts In-Stock

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Digiode

USA . 1,066 parts In-Stock

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1,066

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Distributors (Availability)

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One Stop Electronics

USA . 1,423 parts In-Stock

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$4.000

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1,423

$4.000

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AZTECH Wire

Italy . 770 parts In-Stock

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$17.117

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770

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Parana Technologies

USA . 30 parts In-Stock

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$47.428

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30

$47.428

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DigiPath Technology Company

USA . 81 parts In-Stock

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$52.224

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$48.046

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81

$52.224

$48.046

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IDEA Electronic Components Group

UK . 549 parts In-Stock

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$53.290

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$50.626

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$47.961

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549

$53.290

$50.626

$47.961

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ChromeModa Solutions

Germany . 504 parts In-Stock

1+ parts

$53.290

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$43.698

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504

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$43.698

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QUARKTWIN TECHNOLOGY LTD

USA . 13,158 parts In-Stock

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Corphita

USA . 2,974 parts In-Stock

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Microchip USA

USA . 101 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6735IPNR microcontroller. Crafted with precision and expertise, this innovative device offers unrivaled performance and reliability for a wide range of applications. Whether you're delving into IoT projects, robotics, or automation, this microcontroller is your ultimate solution. Experience seamless integration, low power consumption, and exceptional versatility, all packed into a compact and durable package. Elevate your projects to new heights with the Texas Instruments MSP430F6735IPNR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller chip, ensuring longevity and reliability in various applications.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring reliable performance within specified voltage limits.

CPU Family: MSP430

Belongs to a well-established and reputable family of microcontrollers known for their low power consumption and high performance.

ROM Programmability: FLASH

Enables easy and convenient reprogramming of the microcontroller's read-only memory, allowing for flexibility in application development and updates.

Maximum Operating Temperature: 85 °C

Allows the microcontroller to withstand high temperature environments, making it suitable for industrial applications.

Technical Specifications

Microcontrollers MSP430F6735IPNR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MSP430F6735IPNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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