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MSP430F6735IPN

Texas Instruments

MSP430F6735IPN by Texas Instruments

MSP430F6735IPN by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 4096 RAM bytes. It features 5-Ch 10-Bit ADC channels, 3 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI, and UART interfaces.

Median Price

$8.186

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,840 parts In-Stock

1+ parts

$5.941

100+ parts

$4.844

1k+ parts

$3.229

10k+ parts

-

12,840

$5.941

$4.844

$3.229

-

Mouser Electronics

USA . 71 parts In-Stock

1+ parts

$10.430

100+ parts

$7.690

1k+ parts

$5.390

10k+ parts

$5.200

71

$10.430

$7.690

$5.390

$5.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,327 parts In-Stock

1+ parts

$5.644

100+ parts

-

1k+ parts

-

10k+ parts

-

1,327

$5.644

-

-

-

Chip Stock

USA . 3,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,532

-

-

-

-

Vyrian

USA . 3,075 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,075

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,266 parts In-Stock

1+ parts

$5.347

100+ parts

-

1k+ parts

-

10k+ parts

-

2,266

$5.347

-

-

-

Parana Technologies

USA . 2,343 parts In-Stock

1+ parts

$15.750

100+ parts

-

1k+ parts

$16.111

10k+ parts

-

2,343

$15.750

-

$16.111

-

DigiPath Technology Company

USA . 1,514 parts In-Stock

1+ parts

$17.343

100+ parts

-

1k+ parts

-

10k+ parts

-

1,514

$17.343

-

-

-

ChromeModa Solutions

Germany . 5,088 parts In-Stock

1+ parts

$17.697

100+ parts

$14.512

1k+ parts

-

10k+ parts

-

5,088

$17.697

$14.512

-

-

IDEA Electronic Components Group

UK . 256 parts In-Stock

1+ parts

$17.697

100+ parts

$16.812

1k+ parts

$15.927

10k+ parts

-

256

$17.697

$16.812

$15.927

-

Perfect Parts

USA . 221 parts In-Stock

1+ parts

-

100+ parts

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221

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Kepictronics

USA . 59 parts In-Stock

1+ parts

-

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59

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6735IPN microcontroller. Designed with precision and innovation, this product offers unparalleled quality and reliability. Perfect for a wide range of applications in the industrial sector, this microcontroller provides enhanced performance and efficiency. Experience seamless connectivity and advanced features such as ADC channels and PWM channels. Embrace the future with Texas Instruments and elevate your projects to new heights with the MSP430F6735IPN.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher voltage inputs, increasing its flexibility in different power supply scenarios.

Bit Size 16

A 16-bit architecture allows for higher precision and handling of complex data processing tasks efficiently.

Peripheral IC Type MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture in the microcontroller enables faster execution of instructions, making it suitable for high-performance applications.

ADC Channels YES

Having ADC channels allows the microcontroller to interface with analog sensors or inputs, expanding its capability to gather real-world data.

DMA Channels YES

Direct Memory Access (DMA) channels improve data transfer efficiency by allowing data to be transferred between peripherals and memory without CPU intervention.

Connectivity I2C, IRDA(3), SPI(4), UART(3)

Multiple connectivity options like I2C, SPI, and UART enable seamless communication with other devices, enhancing the versatility of the microcontroller in a range of applications.

ROM Programmability FLASH

The flash programmable ROM allows for easy and flexible program updates, reducing development time and enabling firmware upgrades in the field.

Low Power Mode YES

The availability of a low power mode helps in reducing power consumption, extending battery life in portable or energy-efficient applications.

Technical Specifications

Microcontrollers MSP430F6735IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6735IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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