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MSP430F6733IPN

Texas Instruments

MSP430F6733IPN by Texas Instruments

MSP430F6733IPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 0.05 MHz. It features 5-Ch 10-Bit ADC channels and 4 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via I2C, IRDA(3), SPI(4), UART(3).

Median Price

$8.278

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

$2.960

100+ parts

$2.900

1k+ parts

$2.840

10k+ parts

-

90

$2.960

$2.900

$2.840

-

Texas Instruments

USA . 800 parts In-Stock

1+ parts

$6.517

100+ parts

$5.313

1k+ parts

$3.542

10k+ parts

-

800

$6.517

$5.313

$3.542

-

DigiKey

USA . 118 parts In-Stock

1+ parts

$10.040

100+ parts

$7.284

1k+ parts

-

10k+ parts

-

118

$10.040

$7.284

-

-

Mouser Electronics

USA . 70 parts In-Stock

1+ parts

$10.040

100+ parts

$7.290

1k+ parts

$6.960

10k+ parts

$6.520

70

$10.040

$7.290

$6.960

$6.520

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,907 parts In-Stock

1+ parts

$6.191

100+ parts

-

1k+ parts

-

10k+ parts

-

2,907

$6.191

-

-

-

Chip Stock

USA . 35,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35,500

-

-

-

-

Vyrian

USA . 6,112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,112

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,314 parts In-Stock

1+ parts

$5.865

100+ parts

-

1k+ parts

-

10k+ parts

-

2,314

$5.865

-

-

-

Microchip USA

USA . 2,319 parts In-Stock

1+ parts

$24.780

100+ parts

$24.430

1k+ parts

$24.250

10k+ parts

$24.070

2,319

$24.780

$24.430

$24.250

$24.070

Parana Technologies

USA . 1,737 parts In-Stock

1+ parts

$37.065

100+ parts

-

1k+ parts

-

10k+ parts

-

1,737

$37.065

-

-

-

DigiPath Technology Company

USA . 2,077 parts In-Stock

1+ parts

$40.813

100+ parts

-

1k+ parts

-

10k+ parts

-

2,077

$40.813

-

-

-

ChromeModa Solutions

Germany . 5,699 parts In-Stock

1+ parts

$41.646

100+ parts

$34.150

1k+ parts

-

10k+ parts

-

5,699

$41.646

$34.150

-

-

IDEA Electronic Components Group

UK . 1,999 parts In-Stock

1+ parts

$41.646

100+ parts

$39.564

1k+ parts

$37.481

10k+ parts

-

1,999

$41.646

$39.564

$37.481

-

Overview

Unlock the endless possibilities with the Texas Instruments MSP430F6733IPN microcontroller. Designed with precision and reliability, this product offers unparalleled performance in a compact package. Ideal for a wide range of applications, this microcontroller delivers high-quality results while maximizing efficiency. Whether you're a seasoned professional or a hobbyist, the MSP430F6733IPN provides unmatched value and benefits, making it the perfect choice for your next project. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat and chemicals.

Surface Mount: YES

Surface mount technology allows for smaller, lighter, and more efficient electronic devices.

Maximum Supply Voltage: 3.6 V

Higher supply voltage allows for improved performance and functionality of the microcontroller.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage within the microcontroller.

Bit Size: 16

A larger bit size provides increased processing power and capability for more complex operations.

Power Supplies (V): 2/3.3

Having multiple power supply options allows for flexibility in design and compatibility with various systems.

No. of Terminals: 80

More terminals provide additional connectivity options and interfaces for external devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is compact, lightweight, and ideal for applications where space is limited.

Minimum Supply Voltage: 2.4 V

A lower minimum supply voltage allows for efficient power usage and extends the battery life of the device.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this microcontroller can withstand harsh environmental conditions and ensure reliable performance.

CPU Family: MSP430

The MSP430 family is known for its low power consumption, making it suitable for battery-powered devices and energy-efficient applications.

ADC Channels: YES

Analog-to-digital converter channels allow for conversion of real-world signals into digital data for processing and analysis.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

ROM Words: 65536

With a large ROM capacity, this microcontroller can store and execute a significant amount of program instructions.

RAM Words: 4

Although limited, the on-chip RAM provides essential memory storage for temporary data and calculations during operations.

No. of Timers: 4

Multiple timers offer precise timing control and synchronization of events, crucial for various applications and functions.

Analog To Digital Convertors: 5-Ch 10-Bit

Having 5-channel 10-bit ADCs enables the microcontroller to accurately convert analog signals into digital data for processing and measurement.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Versatile connectivity options such as I2C, IrDA, SPI, and UART allow for seamless communication with other devices and peripherals in a network.

ROM Programmability: FLASH

Flash ROM allows for reprogramming and updating the firmware of the microcontroller, making it versatile and adaptable to changing requirements.

Low Power Mode: YES

The low power mode enables the microcontroller to conserve energy in idle or standby conditions, enhancing battery life and efficiency.

Technical Specifications

Microcontrollers MSP430F6733IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6733IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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