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MSP430F6731IPN

Texas Instruments

MSP430F6731IPN by Texas Instruments

MSP430F6731IPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at 0.05 MHz max frequency. It features 5-Ch 10-Bit ADC channels and 3 DMA channels, suitable for industrial applications requiring low power consumption and high-speed data processing. The package style is flatpack with a terminal pitch of 0.5 mm, making it ideal for compact designs in various embedded systems.

Median Price

$4.742

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 421 parts In-Stock

1+ parts

$2.750

100+ parts

$2.700

1k+ parts

$2.640

10k+ parts

-

421

$2.750

$2.700

$2.640

-

Texas Instruments

USA . 1,760 parts In-Stock

1+ parts

$5.697

100+ parts

$4.644

1k+ parts

$3.096

10k+ parts

-

1,760

$5.697

$4.644

$3.096

-

Mouser Electronics

USA . 94 parts In-Stock

1+ parts

$9.280

100+ parts

$6.640

1k+ parts

$4.670

10k+ parts

$4.540

94

$9.280

$6.640

$4.670

$4.540

Arrow

USA . 119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.786

10k+ parts

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119

-

-

$3.786

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,806 parts In-Stock

1+ parts

$5.412

100+ parts

-

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3,806

$5.412

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Bristol Electronics

USA . 19 parts In-Stock

1+ parts

$7.795

100+ parts

$3.898

1k+ parts

-

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19

$7.795

$3.898

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Vyrian

USA . 8,801 parts In-Stock

1+ parts

-

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8,801

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 60 parts In-Stock

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60

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LWI Electronics Inc

India . 21 parts In-Stock

1+ parts

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21

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

1+ parts

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19

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Dan-Mar Components

USA . 19 parts In-Stock

1+ parts

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,319 parts In-Stock

1+ parts

$5.127

100+ parts

-

1k+ parts

-

10k+ parts

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2,319

$5.127

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Parana Technologies

USA . 2,033 parts In-Stock

1+ parts

$56.194

100+ parts

-

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10k+ parts

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2,033

$56.194

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ChromeModa Solutions

Germany . 6,802 parts In-Stock

1+ parts

$63.139

100+ parts

$51.774

1k+ parts

-

10k+ parts

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6,802

$63.139

$51.774

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IDEA Electronic Components Group

UK . 146 parts In-Stock

1+ parts

$63.139

100+ parts

$59.982

1k+ parts

$56.825

10k+ parts

-

146

$63.139

$59.982

$56.825

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DigiPath Technology Company

USA . 1,002 parts In-Stock

1+ parts

-

100+ parts

$56.926

1k+ parts

-

10k+ parts

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1,002

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$56.926

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F6731IPN microcontroller. Designed with cutting-edge technology and precision engineering, this device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, the MSP430F6731IPN delivers seamless connectivity, low power consumption, and advanced features that bring your ideas to life. Trust in Texas Instruments' legacy of excellence and elevate your projects with the MSP430F6731IPN microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to damage, ensuring the longevity of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 3.6 V

Ability to operate at a maximum supply voltage of 3.6V provides flexibility for various power supply options.

On Chip Data RAM Width: 8

Having a data RAM width of 8 bits allows for quick and efficient processing of data within the microcontroller.

Package Shape: SQUARE

Square package shape helps in uniform and compact placement on circuit boards, optimizing space utilization.

Bit Size: 16

16-bit architecture enables the microcontroller to handle larger data sizes and perform more complex operations.

No. of Terminals: 80

Having 80 terminals provides a wide range of input and output options for connecting to external devices and peripherals.

Minimum Supply Voltage: 2.4 V

Ability to operate at a minimum supply voltage of 2.4V ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C allows the microcontroller to remain stable and reliable even in harsh environments.

CPU Family: MSP430

Being part of the MSP430 family ensures compatibility with existing systems and software, making it a reliable choice for development.

Technical Specifications

Microcontrollers MSP430F6731IPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

80

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6731IPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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