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MSP430F6731AIPZR

Texas Instruments

MSP430F6731AIPZR by Texas Instruments

MSP430F6731AIPZR by Texas Instruments is a 16-bit microcontroller with 72 I/O lines, 6-Ch 10-Bit ADC channels, and 3 DMA channels. It operates at a max clock frequency of 25 MHz and features low power mode for industrial applications requiring high-speed processing in a compact package.

Median Price

$4.116

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$4.116

100+ parts

$3.356

1k+ parts

$2.237

10k+ parts

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950

$4.116

$3.356

$2.237

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,243 parts In-Stock

1+ parts

$3.910

100+ parts

-

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3,243

$3.910

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Vyrian

USA . 3,035 parts In-Stock

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3,035

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Distributors (Availability)

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Corphita

USA . 3,588 parts In-Stock

1+ parts

$3.704

100+ parts

-

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3,588

$3.704

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AZTECH Wire

Italy . 897 parts In-Stock

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$20.230

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897

$20.230

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Microchip USA

USA . 1,194 parts In-Stock

1+ parts

$20.560

100+ parts

$20.430

1k+ parts

$20.370

10k+ parts

$20.310

1,194

$20.560

$20.430

$20.370

$20.310

Parana Technologies

USA . 1,489 parts In-Stock

1+ parts

$54.334

100+ parts

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1,489

$54.334

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ChromeModa Solutions

Germany . 2,871 parts In-Stock

1+ parts

$61.050

100+ parts

$50.061

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2,871

$61.050

$50.061

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IDEA Electronic Components Group

UK . 1,334 parts In-Stock

1+ parts

$61.050

100+ parts

$57.998

1k+ parts

$54.945

10k+ parts

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1,334

$61.050

$57.998

$54.945

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DigiPath Technology Company

USA . 1,942 parts In-Stock

1+ parts

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$55.043

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1,942

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$55.043

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Overview

Unlock the power of innovation with the MSP430F6731AIPZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers like this one, designed for a wide range of applications. With its advanced technology and high performance capabilities, this microcontroller offers customers unmatched value, benefits, and advantages. From its low power mode to its connectivity options, the MSP430F6731AIPZR is the perfect solution for your electronic design needs. Experience superior functionality and reliability with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various environments and conditions.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of external components.

Bit Size: 16

A 16-bit microcontroller allows for more complex operations and calculations compared to lower bit sizes, making it suitable for applications requiring higher processing power.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors and signals, expanding its range of applications and potential uses.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient use of resources and optimized performance, making it a good choice for applications where speed and efficiency are crucial.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller can store and process a significant amount of data, enabling it to handle more complex tasks and operations effectively.

Technology: CMOS

CMOS technology offers lower power consumption and higher speed capabilities compared to other technologies, making the microcontroller energy-efficient and suitable for battery-powered applications.

PWM Channels: YES

Having PWM channels allows for precise control of digital signals, making the microcontroller suitable for applications such as motor control, LED dimming, and audio modulation.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Offering multiple connectivity options such as I2C, IRDA, SPI, and UART enables the microcontroller to communicate with a wide range of devices and peripherals, enhancing its versatility and compatibility.

Technical Specifications

Microcontrollers MSP430F6731AIPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6731AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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