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MSP430F6730IPZR

Texas Instruments

MSP430F6730IPZR by Texas Instruments

MSP430F6730IPZR by Texas Instruments is a 16-bit microcontroller with 16384 ROM words, 1024 RAM bytes, and 72 I/O lines. It operates at a max clock frequency of 0.05 MHz and has PWM channels for various applications in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,200 parts In-Stock

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6,200

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Digiode

USA . 2,061 parts In-Stock

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2,061

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Distributors (Availability)

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One Stop Electronics

USA . 565 parts In-Stock

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$15.000

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565

$15.000

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AZTECH Wire

Italy . 246 parts In-Stock

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$15.310

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246

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Parana Technologies

USA . 2,120 parts In-Stock

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$50.348

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$50.348

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ChromeModa Solutions

Germany . 1,377 parts In-Stock

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$56.571

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$46.388

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1,377

$56.571

$46.388

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IDEA Electronic Components Group

UK . 118 parts In-Stock

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$56.571

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$53.742

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$50.914

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118

$56.571

$53.742

$50.914

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Component Stockers USA

USA . 271 parts In-Stock

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$99.990

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271

$99.990

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DigiPath Technology Company

USA . 1,559 parts In-Stock

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$51.004

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$51.004

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Corphita

USA . 1,479 parts In-Stock

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Microchip USA

USA . 492 parts In-Stock

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Overview

Unlock endless possibilities with the MSP430F6730IPZR by Texas Instruments, a microcontroller that delivers unparalleled quality and reliability. Designed for a wide range of applications, this versatile device offers customers the value they need to excel in their projects. With advanced features like ADC and DMA channels, ROM programmability, and a fast clock frequency, this microcontroller provides superior performance and efficiency. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding industrial environments.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a great choice for energy-efficient applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital data, enabling it to interface with a wide range of sensors and devices.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller can efficiently store and process data, facilitating smooth and fast operation of the device.

ROM Programmability: FLASH

The flash ROM programmability enables easy reprogramming of the microcontroller, allowing for flexibility and adaptability in various applications.

Technical Specifications

Microcontrollers MSP430F6730IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6730IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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