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MSP430F6725IPZ

Texas Instruments

MSP430F6725IPZ by Texas Instruments

MSP430F6725IPZ by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 4 RAM words, and 5-Ch 10-Bit ADC channels. Ideal for industrial applications requiring low power consumption and connectivity via I2C, SPI, UART interfaces.

Median Price

$4.918

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,420 parts In-Stock

1+ parts

$3.130

100+ parts

$3.070

1k+ parts

$3.000

10k+ parts

-

1,420

$3.130

$3.070

$3.000

-

Texas Instruments

USA . 3,660 parts In-Stock

1+ parts

$6.707

100+ parts

$5.468

1k+ parts

$3.645

10k+ parts

-

3,660

$6.707

$5.468

$3.645

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,795 parts In-Stock

1+ parts

$6.372

100+ parts

-

1k+ parts

-

10k+ parts

-

2,795

$6.372

-

-

-

Vyrian

USA . 2,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,554

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,293 parts In-Stock

1+ parts

$6.036

100+ parts

-

1k+ parts

-

10k+ parts

-

1,293

$6.036

-

-

-

AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$17.870

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$17.870

-

-

-

Microchip USA

USA . 2,827 parts In-Stock

1+ parts

$18.350

100+ parts

$18.090

1k+ parts

$17.960

10k+ parts

$17.820

2,827

$18.350

$18.090

$17.960

$17.820

Parana Technologies

USA . 716 parts In-Stock

1+ parts

$20.030

100+ parts

-

1k+ parts

$19.963

10k+ parts

-

716

$20.030

-

$19.963

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IDEA Electronic Components Group

UK . 812 parts In-Stock

1+ parts

$22.506

100+ parts

$21.381

1k+ parts

$20.255

10k+ parts

-

812

$22.506

$21.381

$20.255

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ChromeModa Solutions

Germany . 39 parts In-Stock

1+ parts

$22.506

100+ parts

$18.455

1k+ parts

-

10k+ parts

-

39

$22.506

$18.455

-

-

DigiPath Technology Company

USA . 2,126 parts In-Stock

1+ parts

-

100+ parts

$20.291

1k+ parts

-

10k+ parts

-

2,126

-

$20.291

-

-

Perfect Parts

USA . 96 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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96

-

-

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Cyclops Electronics Ltd (Excess)

UK . 43 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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43

-

-

-

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F6725IPZ microcontroller! Designed by a trusted manufacturer in the industry, this cutting-edge device offers unparalleled quality and reliability. Perfect for a wide range of applications, from consumer electronics to industrial automation, this microcontroller provides exceptional value and benefits to customers. Experience seamless connectivity, low power consumption, and advanced features that will take your projects to the next level. Elevate your designs with the MSP430F6725IPZ and unlock endless possibilities in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, which is ideal for portable electronic devices.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making the assembly process more efficient.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V gives flexibility in power supply options and can handle various power sources.

On Chip Data RAM Width: 8

8-bit data RAM width allows for efficient data processing and storage capabilities on the chip.

Package Shape: SQUARE

Square package shape makes it easier to mount and align on PCBs, ensuring secure placement during assembly.

Bit Size: 16

16-bit processing capabilities enable higher computational power and efficiency for advanced applications.

Power Supplies (V): 2/3.3

Support for both 2V and 3.3V power supplies provides compatibility with a variety of power sources and applications.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options and interfaces with external components and peripherals.

Minimum Supply Voltage: 2.4 V

A minimum supply voltage of 2.4V ensures stability and reliability in operation even with lower power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand harsh environmental conditions.

CPU Family: MSP430

Being part of the MSP430 CPU family ensures compatibility with existing MSP430-based systems and tools for seamless integration.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40°C allows for reliable performance in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Support for ADC channels enables analog sensor interfacing and data conversion for diverse sensor-based applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency and reduce CPU workload, improving overall system performance.

Terminal Position: QUAD

Quad terminal position offers more secure and stable connections, ensuring reliable data transmission and communication.

ROM Words: 131072

A large ROM size of 131072 words allows for extensive program storage and flexible firmware development for complex applications.

Maximum Seated Height: 1.6 mm

A low maximum seated height of 1.6mm saves space in compact designs and enables thin profile electronic devices.

RAM Words: 4

4 RAM words provide temporary data storage for efficient processing and computation within the microcontroller.

Width: 14 mm

14mm width offers a compact form factor for easy integration into small electronic devices with limited space.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microcontroller during production and maintenance processes.

Peripherals: 'BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT'

A variety of peripherals including DMA, LCD, RTC, and timers enhance the microcontroller's functionality for diverse application requirements.

Maximum Clock Frequency: 0.05 MHz

Support for a maximum clock frequency of 0.05 MHz enables high-speed processing and real-time operation for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260°C allows for reliable and secure soldering during the assembly of the microcontroller onto PCBs.

Length: 14 mm

14mm length provides a balanced form factor for easy placement and mounting on PCBs, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments with fluctuating temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers fast and efficient data processing capabilities for quick response times in applications.

No. of Timers: 4

Having 4 timers allows for precise timing control and event scheduling for time-sensitive operations in various applications.

RAM Bytes: 4096

4KB of RAM provides ample data storage capacity for processing and computation tasks within the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and secure connections for reliable data transmission and communication.

Analog To Digital Converters: 5-Ch 10-Bit

5-channel 10-bit ADC allows for precise analog signal conversion and sensor interfacing in multi-channel applications.

Maximum Supply Current: 9.54 mA

Low maximum supply current of 9.54mA results in power-efficient operation and extends battery life in portable devices.

Nominal Supply Voltage: 3 V

Support for a nominal supply voltage of 3V ensures stable and consistent power delivery for reliable performance.

No. of DMA Channels: 3

3 DMA channels facilitate efficient data transfer between peripherals and memory, reducing CPU overhead and improving system throughput.

No. of Serial I/Os: 4

4 serial I/O interfaces enable communication with external devices and sensors, enhancing connectivity and data exchange capabilities.

PWM Channels: YES

Support for PWM channels allows for precise control of analog outputs and motor speed regulation in various applications.

Connectivity: 'I2C, IRDA(3), SPI(4), UART(3)'

Multiple connectivity options including I2C, IRDA, SPI, and UART facilitate communication with a wide range of external devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and customization of the microcontroller's functionality to meet specific application requirements.

Terminal Pitch: 0.5 mm

Fine 0.5mm terminal pitch allows for high density mounting on PCBs, enabling compact designs and efficient use of board space.

Format: FIXED POINT

Fixed-point format simplifies numerical computations and enhances arithmetic operations within the microcontroller for accurate results.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, requiring standard handling and storage practices to prevent damage.

Speed: 25 rpm

Support for a speed of 25rpm ensures efficient data processing and execution of tasks, making it suitable for real-time applications.

Low Power Mode: YES

Low power mode functionality reduces power consumption during idle periods, extending battery life and energy efficiency in portable devices.

On Chip Program ROM Width: 8

8-bit program ROM width facilitates efficient program execution and storage within the microcontroller for fast and reliable operation.

No. of I/O Lines: 72

Having 72 I/O lines allows for versatile input/output configurations and interfacing with external components for flexible system connectivity.

Technical Specifications

Microcontrollers MSP430F6725IPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 MIN AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.05 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(3), SPI(4), UART(3)"

Peripherals:

"BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT"

Analog To Digital Convertors:

5-Ch 10-Bit

Trade Compliance

MSP430F6725IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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