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MSP430F6720AIPZ

Texas Instruments

MSP430F6720AIPZ by Texas Instruments

MSP430F6720AIPZ by Texas Instruments is a 16-bit microcontroller with 16384 ROM words, 1024 RAM bytes, and 6-Ch 10-Bit ADC channels. It operates at a max clock frequency of 25 MHz and features low power mode for industrial applications requiring high-speed processing within a temperature range of -40 to 85 °C.

Median Price

$5.606

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,460 parts In-Stock

1+ parts

$5.606

100+ parts

$4.912

1k+ parts

$2.775

10k+ parts

-

1,460

$5.606

$4.912

$2.775

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,419 parts In-Stock

1+ parts

$5.326

100+ parts

-

1k+ parts

-

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1,419

$5.326

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Vyrian

USA . 6,260 parts In-Stock

1+ parts

-

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6,260

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,172 parts In-Stock

1+ parts

$5.045

100+ parts

-

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-

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1,172

$5.045

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AZTECH Wire

Italy . 147 parts In-Stock

1+ parts

$12.790

100+ parts

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147

$12.790

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Microchip USA

USA . 2,963 parts In-Stock

1+ parts

$32.430

100+ parts

$32.230

1k+ parts

$32.130

10k+ parts

$32.030

2,963

$32.430

$32.230

$32.130

$32.030

Parana Technologies

USA . 559 parts In-Stock

1+ parts

$40.821

100+ parts

-

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-

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559

$40.821

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DigiPath Technology Company

USA . 354 parts In-Stock

1+ parts

$44.949

100+ parts

$41.353

1k+ parts

-

10k+ parts

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354

$44.949

$41.353

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IDEA Electronic Components Group

UK . 2,272 parts In-Stock

1+ parts

$45.866

100+ parts

$43.573

1k+ parts

$41.279

10k+ parts

-

2,272

$45.866

$43.573

$41.279

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ChromeModa Solutions

Germany . 603 parts In-Stock

1+ parts

$45.866

100+ parts

$37.610

1k+ parts

-

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603

$45.866

$37.610

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Component Stockers USA

USA . 26 parts In-Stock

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26

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Overview

Unleash the power of innovation with the MSP430F6720AIPZ microcontroller from industry leader Texas Instruments. This cutting-edge device offers unmatched quality and reliability, making it the perfect choice for a wide range of applications. With advanced features such as multiple ADC channels, DMA capabilities, and low power modes, this microcontroller delivers exceptional performance while maximizing efficiency. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, the MSP430F6720AIPZ provides the value, flexibility, and reliability you need to bring your ideas to life. Choose Texas Instruments for your next project and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and reliability for the microcontroller, making it suitable for a variety of applications.

Bit Size: 16

A 16-bit architecture allows for more complex processing and calculations compared to lower bit sizes, enabling this microcontroller to handle more advanced tasks.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making this microcontroller a good choice for energy-efficient applications.

ADC Channels: YES

Having Analog to Digital Converter channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities for a wider range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture results in efficient execution of instructions, faster processing speeds, and overall improved performance.

RAM Bytes: 1024

With 1024 bytes of Random Access Memory (RAM), the microcontroller can efficiently store and access data during program execution, enhancing overall performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology is known for low power consumption, making this microcontroller energy efficient and suitable for battery-powered applications.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of analog signals, enabling the microcontroller to interface with motors, LEDs, and other devices that require variable voltage levels.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Support for various communication protocols such as I2C, Infrared Data Association (IRDA), Serial Peripheral Interface (SPI), and Universal Asynchronous Receiver-Transmitter (UART) enhances the microcontroller's connectivity options for diverse applications.

Technical Specifications

Microcontrollers MSP430F6720AIPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6720AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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