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MSP430F6720AIPN

Texas Instruments

MSP430F6720AIPN by Texas Instruments

MSP430F6720AIPN by Texas Instruments is a 16-bit microcontroller with 80 terminals, operating at up to 25 MHz. It features 3 ADC and DMA channels, suitable for industrial applications requiring low power consumption and high-speed processing. With peripherals like BOR, LCD, and RTC, it offers versatile connectivity via I2C, SPI, and UART interfaces.

Median Price

$5.468

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,082 parts In-Stock

1+ parts

$5.468

100+ parts

$4.791

1k+ parts

$2.707

10k+ parts

-

3,082

$5.468

$4.791

$2.707

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 397 parts In-Stock

1+ parts

$5.195

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$5.195

-

-

-

Vyrian

USA . 3,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,266

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,105 parts In-Stock

1+ parts

$4.921

100+ parts

-

1k+ parts

-

10k+ parts

-

3,105

$4.921

-

-

-

AZTECH Wire

Italy . 1,007 parts In-Stock

1+ parts

$11.620

100+ parts

-

1k+ parts

-

10k+ parts

-

1,007

$11.620

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-

-

Microchip USA

USA . 2,839 parts In-Stock

1+ parts

$31.630

100+ parts

$31.440

1k+ parts

$31.340

10k+ parts

$31.240

2,839

$31.630

$31.440

$31.340

$31.240

Parana Technologies

USA . 1,260 parts In-Stock

1+ parts

$41.608

100+ parts

-

1k+ parts

-

10k+ parts

-

1,260

$41.608

-

-

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DigiPath Technology Company

USA . 1,869 parts In-Stock

1+ parts

$45.815

100+ parts

$42.150

1k+ parts

-

10k+ parts

-

1,869

$45.815

$42.150

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-

ChromeModa Solutions

Germany . 1,631 parts In-Stock

1+ parts

$46.750

100+ parts

$38.335

1k+ parts

-

10k+ parts

-

1,631

$46.750

$38.335

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-

IDEA Electronic Components Group

UK . 136 parts In-Stock

1+ parts

$46.750

100+ parts

$44.412

1k+ parts

$42.075

10k+ parts

-

136

$46.750

$44.412

$42.075

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Overview

Unlock the power of innovation with the MSP430F6720AIPN microcontroller by Texas Instruments. Designed with precision and quality in mind, this versatile device offers a wide range of applications for your projects. From its low power mode to its high-speed connectivity options, this microcontroller provides value and efficiency like no other. Experience seamless performance and reliability with this top-of-the-line product from a trusted manufacturer. Elevate your designs and take your projects to the next level with the MSP430F6720AIPN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the microcontroller onto circuit boards.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources.

Bit Size: 16

16-bit architecture provides increased processing power and efficiency for complex tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller based on Reduced Instruction Set Computing (RISC) architecture, it offers high performance and power efficiency.

Maximum Clock Frequency: 25 MHz

High clock frequency of 25 MHz allows for fast operation and response times.

ROM Programmability: FLASH

The use of Flash memory for ROM programming enables easy updates and modifications to the firmware.

RAM Bytes: 1024

Having 1024 bytes of RAM allows for efficient data storage and manipulation during program execution.

ADC Channels: YES

The presence of ADC channels allows for analog signal acquisition and conversion, expanding the range of applications the microcontroller can be used for.

DMA Channels: YES

DMA channels help in offloading data transfer tasks from the CPU, improving overall system performance.

Connectivity: I2C, IRDA(3), SPI(4), UART(3)

Support for multiple communication protocols such as I2C, IRDA, SPI, and UART ensures compatibility and flexibility in interfacing with other devices.

Technical Specifications

Microcontrollers MSP430F6720AIPN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

72

No. of Terminals:

80

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Current:

9.54 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA(3), SPI(4), UART(3)

Peripherals:

BOR, DMA(3), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

MSP430F6720AIPN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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