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MSP430F6659IZCAR

Texas Instruments

MSP430F6659IZCAR by Texas Instruments

MSP430F6659IZCAR by Texas Instruments is a 16-bit microcontroller with 113 terminals, featuring 65536 RAM words and 524288 ROM words. It operates at a max clock frequency of 32 MHz and offers various peripherals like BOR, PWM, RTC, and WDT. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$13.601

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,325 parts In-Stock

1+ parts

$13.601

100+ parts

$11.088

1k+ parts

$7.392

10k+ parts

-

12,325

$13.601

$11.088

$7.392

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,973 parts In-Stock

1+ parts

$12.921

100+ parts

-

1k+ parts

-

10k+ parts

-

1,973

$12.921

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-

-

Vyrian

USA . 6,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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6,426

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Chip Stock

USA . 4,100 parts In-Stock

1+ parts

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4,100

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 791 parts In-Stock

1+ parts

$12.241

100+ parts

-

1k+ parts

-

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791

$12.241

-

-

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AZTECH Wire

Italy . 73 parts In-Stock

1+ parts

$21.560

100+ parts

-

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10k+ parts

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73

$21.560

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Parana Technologies

USA . 419 parts In-Stock

1+ parts

$22.659

100+ parts

-

1k+ parts

$23.315

10k+ parts

-

419

$22.659

-

$23.315

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DigiPath Technology Company

USA . 1,768 parts In-Stock

1+ parts

$24.950

100+ parts

-

1k+ parts

-

10k+ parts

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1,768

$24.950

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-

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IDEA Electronic Components Group

UK . 2,338 parts In-Stock

1+ parts

$25.459

100+ parts

$24.186

1k+ parts

$22.913

10k+ parts

-

2,338

$25.459

$24.186

$22.913

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ChromeModa Solutions

Germany . 2,132 parts In-Stock

1+ parts

$25.459

100+ parts

$20.876

1k+ parts

-

10k+ parts

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2,132

$25.459

$20.876

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Microchip USA

USA . 2,366 parts In-Stock

1+ parts

$26.760

100+ parts

$26.380

1k+ parts

$26.180

10k+ parts

$25.990

2,366

$26.760

$26.380

$26.180

$25.990

Overview

Unlock endless possibilities with the MSP430F6659IZCAR from Texas Instruments, a leading manufacturer in the industry. This microcontroller offers unparalleled quality and reliability, making it ideal for a wide range of applications. With advanced features such as DAC and ADC channels, DMA capabilities, and low power mode, this product provides unmatched value to customers looking for high-performance solutions. Experience the benefits of seamless connectivity, fast clock frequencies, and extensive peripherals, all in a compact and durable package. Discover the power of innovation with the MSP430F6659IZCAR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage, allowing for flexibility in power requirements for different projects.

No. of Terminals: 113

Having a large number of terminals provides ample connectivity options for interfacing with external components and peripherals.

Maximum Clock Frequency: 32 MHz

With a high clock frequency, the microcontroller can handle complex tasks and processes at a fast pace, improving overall performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient processing and execution of instructions, making the microcontroller suitable for real-time applications.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16 channels for analog to digital conversion with 12-bit resolution allows for precise and accurate sensor data acquisition.

Technical Specifications

Microcontrollers MSP430F6659IZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of I/O Lines:

74

No. of Serial I/Os:

3

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Maximum Supply Current:

7.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6659IZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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