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MSP430F6658IPZR

Texas Instruments

MSP430F6658IPZR by Texas Instruments

MSP430F6658IPZR by Texas Instruments is a 16-bit microcontroller with 2/3.3V supplies, 393216 ROM words, and 16-Ch 12-Bit ADC. Ideal for industrial applications, it features BOR, LCD, RTC, and USB connectivity in a compact flatpack package with low profile at 14x14mm size. Operating b/w -40 to 85°C, it offers high performance with a max clock frequency of 32MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,454 parts In-Stock

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Digiode

USA . 3,615 parts In-Stock

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3,615

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Distributors (Availability)

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AZTECH Wire

Italy . 382 parts In-Stock

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$5.440

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382

$5.440

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One Stop Electronics

USA . 1,537 parts In-Stock

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$6.000

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Parana Technologies

USA . 1,941 parts In-Stock

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$28.855

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$52.572

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1,941

$28.855

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$52.572

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DigiPath Technology Company

USA . 993 parts In-Stock

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$31.773

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993

$31.773

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ChromeModa Solutions

Germany . 1,714 parts In-Stock

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$32.421

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$26.585

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1,714

$32.421

$26.585

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IDEA Electronic Components Group

UK . 1,309 parts In-Stock

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$32.421

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$30.800

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$29.179

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1,309

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$29.179

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QUARKTWIN TECHNOLOGY LTD

USA . 19,227 parts In-Stock

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Microchip USA

USA . 6,315 parts In-Stock

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Corphita

USA . 961 parts In-Stock

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Overview

Elevate your designs with the MSP430F6658IPZR by Texas Instruments, a top-tier microcontroller that embodies quality and innovation. As a leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile microcontroller is perfect for a wide range of applications, offering unmatched value, performance, and reliability. Experience seamless connectivity and advanced features with the MSP430F6658IPZR, setting new standards in the world of microcontrollers. Upgrade your projects today with this exceptional device!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for versatility in power options and potential applications.

Bit Size: 16

16-bit processing capability allows for more complex calculations and tasks to be handled efficiently.

ADC Channels: YES

Analog to Digital Converters provide the ability to interface with analog sensors and devices, expanding the range of possible applications.

Maximum Clock Frequency: 32 MHz

Higher clock frequency enables faster processing speeds and overall performance of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of outputs such as motors and LEDs, enhancing versatility and functionality.

Technical Specifications

Microcontrollers MSP430F6658IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V MIN SUPPLY AT 8 MHZ, ALSO HAVING ADDITIONAL 2KB SRAM WHEN USB NOT IN USE

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6658IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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