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MSP430F6637IZQWT

Texas Instruments

MSP430F6637IZQWT by Texas Instruments

MSP430F6637IZQWT by Texas Instruments is a 16-bit microcontroller with 2/3.3V power supplies, 113 terminals, and 32MHz max clock frequency. Ideal for industrial applications requiring ADC/DAC channels, DMA support, and various peripherals like LCD and timers. Package style: grid array with thin profile and fine pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,861 parts In-Stock

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Digiode

USA . 564 parts In-Stock

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564

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Distributors (Availability)

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AZTECH Wire

Italy . 646 parts In-Stock

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$16.054

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646

$16.054

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One Stop Electronics

USA . 709 parts In-Stock

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$18.000

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709

$18.000

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Parana Technologies

USA . 71 parts In-Stock

1+ parts

$29.986

100+ parts

$2,784.644

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$26.987

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71

$29.986

$2,784.644

$26.987

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DigiPath Technology Company

USA . 1,259 parts In-Stock

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$33.018

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$30.377

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1,259

$33.018

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ChromeModa Solutions

Germany . 4,760 parts In-Stock

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$33.692

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$27.627

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4,760

$33.692

$27.627

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IDEA Electronic Components Group

UK . 116 parts In-Stock

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$33.692

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$32.007

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$30.323

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116

$33.692

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$30.323

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Component Stockers USA

USA . 367 parts In-Stock

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$99.990

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367

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Corphita

USA . 1,552 parts In-Stock

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Microchip USA

USA . 402 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6637IZQWT microcontroller. Crafted with precision by a renowned manufacturer, this powerful device offers unparalleled performance in a compact package. Ideal for a wide range of applications, this microcontroller boasts advanced features such as DAC channels, ADC channels, and DMA channels. Experience seamless connectivity with I2C, IRDA, SPI, UART, and USB interfaces. With industrial-grade durability and exceptional speed, the MSP430F6637IZQWT is the ultimate solution for your next project. Elevate your designs and unleash your creativity with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Bit Size: 16

The 16-bit size provides good processing capability for handling complex tasks and calculations efficiently.

DAC Channels: YES

Having DAC channels allows for the conversion of digital signals to analog signals, which is useful in many applications requiring precise analog outputs.

Peripherals: BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

A wide range of peripherals provides versatility and additional functionalities for various applications, enhancing the overall performance of the product.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency enables fast data processing and overall performance, suitable for time-sensitive applications.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy reprogramming and updates, making the product adaptable to changing requirements and future improvements.

Analog To Digital Convertors: 16-Ch 12-Bit

Having 16 channels of 12-bit ADCs provides high accuracy and resolution for capturing analog signals, making the product suitable for precision measurement and control applications.

Technical Specifications

Microcontrollers MSP430F6637IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

18432

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6637IZQWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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