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MSP430F6637IPZR

Texas Instruments

MSP430F6637IPZR by Texas Instruments

MSP430F6637IPZR by Texas Instruments is a 16-bit microcontroller with 196608 ROM words, 16384 RAM bytes, and a max clock frequency of 32 MHz. Ideal for industrial applications requiring a low-profile package with 100 terminals and support for DAC, ADC, DMA channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,727 parts In-Stock

1+ parts

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5,727

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Digiode

USA . 3,670 parts In-Stock

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3,670

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 998 parts In-Stock

1+ parts

$13.000

100+ parts

-

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998

$13.000

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AZTECH Wire

Italy . 564 parts In-Stock

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$18.306

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564

$18.306

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Parana Technologies

USA . 1,652 parts In-Stock

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$70.182

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1,652

$70.182

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DigiPath Technology Company

USA . 1,879 parts In-Stock

1+ parts

$77.279

100+ parts

$71.097

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1,879

$77.279

$71.097

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ChromeModa Solutions

Germany . 6,156 parts In-Stock

1+ parts

$78.856

100+ parts

$64.662

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6,156

$78.856

$64.662

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IDEA Electronic Components Group

UK . 670 parts In-Stock

1+ parts

$78.856

100+ parts

$74.913

1k+ parts

$70.970

10k+ parts

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670

$78.856

$74.913

$70.970

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Corphita

USA . 2,093 parts In-Stock

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2,093

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Microchip USA

USA . 374 parts In-Stock

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374

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Overview

Experience the power and reliability of Texas Instruments with the MSP430F6637IPZR microcontroller. Perfect for a wide range of applications, this device boasts exceptional performance and efficiency. With its innovative features and superior quality, it delivers unparalleled value to customers looking for a reliable solution. Whether you're working on consumer electronics, industrial automation, or IoT devices, this microcontroller is sure to meet your needs and exceed your expectations. Trust in Texas Instruments for top-of-the-line technology that brings your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various operating environments.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, enhancing flexibility in design and application.

Bit Size: 16

Offers a good balance between processing power and memory efficiency for handling tasks efficiently.

DAC Channels: YES

Enables the microcontroller to interface with analog devices, expanding its capabilities in signal processing and control applications.

Power Supplies (V): 2/3.3

Supports different voltage requirements, catering to various electronic components and system configurations.

No. of Terminals: 100

Provides sufficient connections for interfacing with external devices and peripherals, enhancing the microcontroller's versatility.

ADC Channels: YES

Allows for analog input signal conversion, enabling the microcontroller to gather data from sensors or other analog sources.

DMA Channels: YES

Facilitates efficient data transfer between memory and peripherals, improving overall performance and responsiveness.

ROM Words: 196608

Offers ample storage space for program instructions and data, supporting complex algorithms and applications.

Maximum Clock Frequency: 32 MHz

Delivers high processing speed for quick execution of tasks, enhancing the microcontroller's performance in real-time applications.

RAM Bytes: 16384

Provides sufficient memory for temporary data storage and processing, ensuring smooth operation of applications.

Technical Specifications

Microcontrollers MSP430F6637IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6637IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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