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MSP430F6635IZQWR

Texas Instruments

MSP430F6635IZQWR by Texas Instruments

MSP430F6635IZQWR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words, 16384 RAM bytes, and 16 ADC channels. Ideal for industrial applications, it offers a max clock frequency of 32 MHz and features connectivity options like I2C, IRDA, SCI(2), SPI(2), UART.

Median Price

$5.270

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,724 parts In-Stock

1+ parts

$5.270

100+ parts

$5.160

1k+ parts

$5.060

10k+ parts

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$5.270

$5.160

$5.060

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Distributors (In-Stock)

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Vyrian

USA . 3,631 parts In-Stock

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3,631

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Digiode

USA . 311 parts In-Stock

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311

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Elcom Components

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$5.732

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233

$5.732

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One Stop Electronics

USA . 1,112 parts In-Stock

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$23.000

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$23.000

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Parana Technologies

USA . 1,237 parts In-Stock

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$64.664

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$64.664

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DigiPath Technology Company

USA . 73 parts In-Stock

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$71.203

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73

$71.203

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ChromeModa Solutions

Germany . 6,231 parts In-Stock

1+ parts

$72.656

100+ parts

$59.578

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6,231

$72.656

$59.578

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IDEA Electronic Components Group

UK . 1,612 parts In-Stock

1+ parts

$72.656

100+ parts

$69.023

1k+ parts

$65.390

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1,612

$72.656

$69.023

$65.390

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Component Stockers USA

USA . 789 parts In-Stock

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$99.990

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789

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Perfect Parts

USA . 4,301 parts In-Stock

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Corphita

USA . 3,766 parts In-Stock

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Microchip USA

USA . 210 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F6635IZQWR microcontroller. Built to deliver top-notch quality and reliability, this device is perfect for a wide range of applications in various industries. With cutting-edge technology and advanced features, this microcontroller offers unparalleled value and benefits to customers looking to take their projects to the next level. Trust in Texas Instruments to provide you with the tools you need to succeed and stay ahead of the competition. Elevate your designs with the MSP430F6635IZQWR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the microcontroller lightweight and durable, ideal for applications where weight and durability are important factors.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of voltage inputs.

Bit Size: 16

The 16-bit architecture of the microcontroller allows for faster processing and more complex operations compared to lower bit sizes.

ROM Words: 262144

The large ROM capacity enables storage of a significant amount of program data and code, making it suitable for applications that require extensive program storage.

Maximum Clock Frequency: 32 MHz

The high clock frequency allows for fast operation and execution of instructions, making the microcontroller suitable for applications that require quick response times.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller uses a Reduced Instruction Set Computing (RISC) architecture, which enhances performance by simplifying instruction set and reducing execution time.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and signals, making it versatile for a wide range of applications.

Connectivity: I2C, IRDA, SCI(2), SPI(2), UART

The multiple connectivity options provided by I2C, IRDA, SCI, SPI, and UART enable seamless communication with other devices, making it suitable for diverse networking and communication applications.

Technical Specifications

Microcontrollers MSP430F6635IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

113

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F6635IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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