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MSP430F6635IPZR

Texas Instruments

MSP430F6635IPZR by Texas Instruments

MSP430F6635IPZR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 16384 RAM bytes. It features 16-Ch 12-Bit ADC channels, 18 timers, and connectivity options like I2C, IRDA, SCI(2), SPI(2), UART. Ideal for industrial applications requiring low power consumption and high performance.

Median Price

$6.201

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 683 parts In-Stock

1+ parts

$5.160

100+ parts

$5.060

1k+ parts

$4.950

10k+ parts

-

683

$5.160

$5.060

$4.950

-

Texas Instruments

USA . 5,268 parts In-Stock

1+ parts

$7.242

100+ parts

$5.904

1k+ parts

$3.936

10k+ parts

-

5,268

$7.242

$5.904

$3.936

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,385 parts In-Stock

1+ parts

$4.902

100+ parts

-

1k+ parts

-

10k+ parts

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4,385

$4.902

-

-

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Vyrian

USA . 8,257 parts In-Stock

1+ parts

-

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-

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8,257

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-

-

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Nova Conductors

Japan . 42 parts In-Stock

1+ parts

-

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42

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,934 parts In-Stock

1+ parts

$4.390

100+ parts

$4.280

1k+ parts

$4.258

10k+ parts

-

2,934

$4.390

$4.280

$4.258

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Ampacity Inc.

Singapore . 2,807 parts In-Stock

1+ parts

$4.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,807

$4.390

-

-

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Corphita

USA . 4,823 parts In-Stock

1+ parts

$4.644

100+ parts

-

1k+ parts

-

10k+ parts

-

4,823

$4.644

-

-

-

Advanced Electronics

New Zealand . 16 parts In-Stock

1+ parts

$5.981

100+ parts

$5.503

1k+ parts

$5.156

10k+ parts

-

16

$5.981

$5.503

$5.156

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Corohmni

South Africa . 9 parts In-Stock

1+ parts

$6.290

100+ parts

-

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-

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9

$6.290

-

-

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AZTECH Wire

Italy . 591 parts In-Stock

1+ parts

$15.180

100+ parts

-

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591

$15.180

-

-

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Parana Technologies

USA . 524 parts In-Stock

1+ parts

$39.054

100+ parts

-

1k+ parts

-

10k+ parts

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524

$39.054

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-

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DigiPath Technology Company

USA . 2,160 parts In-Stock

1+ parts

$43.003

100+ parts

$39.563

1k+ parts

-

10k+ parts

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2,160

$43.003

$39.563

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ChromeModa Solutions

Germany . 3,789 parts In-Stock

1+ parts

$43.881

100+ parts

$35.982

1k+ parts

-

10k+ parts

-

3,789

$43.881

$35.982

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IDEA Electronic Components Group

UK . 124 parts In-Stock

1+ parts

$43.881

100+ parts

$41.687

1k+ parts

$39.493

10k+ parts

-

124

$43.881

$41.687

$39.493

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Continental Prestige Electronics

USA . 6,888 parts In-Stock

1+ parts

-

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6,888

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Argo Parts USA

USA . 4,149 parts In-Stock

1+ parts

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4,149

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-

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Bastille Electronics

Australia . 74 parts In-Stock

1+ parts

-

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74

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F6635IPZR microcontroller. Crafted with precision and expertise, this versatile device offers a wide range of applications in various industries. Experience seamless connectivity and enhanced performance, thanks to its cutting-edge technology. Whether you're designing smart gadgets or implementing automation systems, this microcontroller delivers unmatched efficiency and reliability. Elevate your projects with the superior quality and advanced features of the MSP430F6635IPZR, setting new standards in microcontroller excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and protection of internal components.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power options and compatibility with different systems.

ADC Channels: YES

Enables analog to digital conversion for accurate measurements and sensor interfacing.

ROM Words: 262144

Large ROM capacity for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing for efficient and fast processing.

Analog To Digital Convertors: 16-Ch 12-Bit

Provides multiple channels for converting analog signals to digital values with high precision.

Connectivity: I2C, IRDA, SCI(2), SPI(2), UART

Offers versatile communication options for connecting to different devices and networks.

Technical Specifications

Microcontrollers MSP430F6635IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

1

No. of Terminals:

100

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SCI(2), SPI(2), UART"

Peripherals:

"BOR, COMPARATOR(12), CRC, DMA(6), RTC, TIMER(18), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430F6635IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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