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MSP430F6632IZQWR

Texas Instruments

MSP430F6632IZQWR by Texas Instruments

MSP430F6632IZQWR by Texas Instruments is a 16-bit microcontroller with 262144 ROM words and 16384 RAM bytes. Operating at up to 32 MHz, it has 74 I/O lines and PWM channels for industrial applications requiring low power consumption. With a package size of 7x7 mm, it offers advanced features like DMA channels and flash ROM programmability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,212 parts In-Stock

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Digiode

USA . 3,360 parts In-Stock

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3,360

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Distributors (Availability)

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AZTECH Wire

Italy . 582 parts In-Stock

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$6.165

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One Stop Electronics

USA . 281 parts In-Stock

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$22.000

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Parana Technologies

USA . 381 parts In-Stock

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$60.671

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DigiPath Technology Company

USA . 2,261 parts In-Stock

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$66.807

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ChromeModa Solutions

Germany . 3,422 parts In-Stock

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$68.170

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$55.899

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IDEA Electronic Components Group

UK . 1,084 parts In-Stock

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$68.170

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$64.762

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$61.353

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1,084

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$61.353

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Corphita

USA . 4,708 parts In-Stock

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Microchip USA

USA . 447 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the Texas Instruments MSP430F6632IZQWR microcontroller. Crafted by a renowned manufacturer, this device offers top-tier quality and reliability for a wide range of applications. From smart home devices to industrial automation, this microcontroller delivers superior value, benefits, and advantages to customers seeking cutting-edge technology. Experience seamless integration, robust functionality, and optimized power management with the MSP430F6632IZQWR, setting a new standard in microcontroller excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit board design, saving space and making the product suitable for small form factor applications.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs without risk of damage.

Bit Size: 16

A 16-bit architecture allows for more complex calculations and processing capabilities compared to lower bit sizes, enhancing the microcontroller's performance.

Power Supplies (V): 2/3.3

Supports multiple power supply options, providing flexibility in design and compatibility with various power sources.

No. of Terminals: 113

A high number of terminals allows for versatile connectivity options and integration with other components in the system.

Maximum Clock Frequency: 32 MHz

With a high clock frequency, this microcontroller can execute instructions quickly, enabling fast and responsive operation.

ROM Words: 262144

A large ROM capacity allows for storing a significant amount of program data, enabling complex applications to be implemented on the microcontroller.

RAM Bytes: 16384

Sufficient RAM capacity for temporary data storage during operation, facilitating efficient multitasking and data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture simplifies the instruction set, leading to faster execution and better performance of the microcontroller.

Technical Specifications

Microcontrollers MSP430F6632IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8V AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

74

No. of Terminals:

113

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430F6632IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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