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MSP430F6459TPZR

Texas Instruments

MSP430F6459TPZR by Texas Instruments

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$21.018

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,479 parts In-Stock

1+ parts

$18.617

100+ parts

$16.262

1k+ parts

$11.215

10k+ parts

-

5,479

$18.617

$16.262

$11.215

-

DigiKey

USA . 896 parts In-Stock

1+ parts

$23.420

100+ parts

$16.352

1k+ parts

$15.380

10k+ parts

-

896

$23.420

$16.352

$15.380

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$13.733

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$13.733

-

-

-

Digiode

USA . 2,189 parts In-Stock

1+ parts

$17.686

100+ parts

-

1k+ parts

-

10k+ parts

-

2,189

$17.686

-

-

-

Vyrian

USA . 2,983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,983

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,756 parts In-Stock

1+ parts

$11.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2,756

$11.920

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$13.733

100+ parts

$13.458

1k+ parts

$13.046

10k+ parts

$12.771

100

$13.733

$13.458

$13.046

$12.771

Corphita

USA . 3,753 parts In-Stock

1+ parts

$16.755

100+ parts

-

1k+ parts

-

10k+ parts

-

3,753

$16.755

-

-

-

Parana Technologies

USA . 947 parts In-Stock

1+ parts

$19.101

100+ parts

-

1k+ parts

$19.152

10k+ parts

-

947

$19.101

-

$19.152

-

DigiPath Technology Company

USA . 1,459 parts In-Stock

1+ parts

$21.033

100+ parts

-

1k+ parts

-

10k+ parts

-

1,459

$21.033

-

-

-

ChromeModa Solutions

Germany . 3,844 parts In-Stock

1+ parts

$21.462

100+ parts

$17.599

1k+ parts

-

10k+ parts

-

3,844

$21.462

$17.599

-

-

IDEA Electronic Components Group

UK . 2,027 parts In-Stock

1+ parts

$21.462

100+ parts

$20.389

1k+ parts

$19.316

10k+ parts

-

2,027

$21.462

$20.389

$19.316

-

Microchip USA

USA . 2,164 parts In-Stock

1+ parts

$39.250

100+ parts

$38.690

1k+ parts

$38.410

10k+ parts

$38.130

2,164

$39.250

$38.690

$38.410

$38.130

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$47.158

100+ parts

$42.914

1k+ parts

$38.670

10k+ parts

-

2,500

$47.158

$42.914

$38.670

-

Technical Specifications

Microcontrollers MSP430F6459TPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 8 MHZ AT 1.8V MIN SUPPLY, ALSO HAVING 2KB SRAM WHEN USB NOT USED

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

74

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

67584

RAM Words:

66

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

BOR, COMPARATOR(12), DMA(6), LCD, POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430F6459TPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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